IC,ANALOG SWITCH,DUAL,SPDT,CMOS,DIP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | not_compliant |
| Analog Integrated Circuits - Other Types | SPDT |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum on-state resistance (Ron) | 75 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| output | SEPARATE OUTPUT |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum connection time | 250 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| HI3-0307-5 | HI2-0301-2 | HI2-0301-5 | HI9P-0303-9 | HI9P-0303-5 | HI1-0301-2 | HI1-0301-5 | HI1-0307-2 | HI3-0301-5 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC,ANALOG SWITCH,DUAL,SPDT,CMOS,DIP,14PIN,PLASTIC | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,CAN,10PIN,METAL | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,CAN,10PIN,METAL | IC DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO14, Multiplexer or Switch | IC DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO14, Multiplexer or Switch | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,DIP,14PIN,CERAMIC | HI1-0301-5 | IC,ANALOG SWITCH,DUAL,SPDT,CMOS,DIP,14PIN,CERAMIC | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,DIP,14PIN,PLASTIC |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant | _compli |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | - | incompatible | incompatible | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | - | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Analog Integrated Circuits - Other Types | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | - | SPDT |
| JESD-30 code | R-PDIP-T14 | O-MBCY-W10 | O-MBCY-W10 | R-PDSO-G14 | R-PDSO-G14 | R-XDIP-T14 | R-XDIP-T14 | - | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | - | - | e0 | e0 | - | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | - | -15 V |
| Number of functions | 2 | 1 | 1 | 2 | 2 | 1 | 1 | - | 1 |
| Number of terminals | 14 | 10 | 10 | 14 | 14 | 14 | 14 | - | 14 |
| Maximum on-state resistance (Ron) | 75 Ω | 75 Ω | 75 Ω | 50 Ω | 50 Ω | 75 Ω | 75 Ω | - | 75 Ω |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 85 °C | 75 °C | 125 °C | 70 °C | - | 70 °C |
| Package body material | PLASTIC/EPOXY | METAL | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | - | PLASTIC/EPOXY |
| Encapsulate equivalent code | DIP14,.3 | CAN10,.23 | CAN10,.23 | - | - | DIP14,.3 | DIP14,.3 | - | DIP14,.3 |
| Package shape | RECTANGULAR | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | - | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | - | - | +-15 V | +-15 V | - | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | - | 15 V |
| surface mount | NO | - | - | YES | YES | NO | NO | - | NO |
| Maximum connection time | 250 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | - | 300 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | INDUSTRIAL | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL | - | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | WIRE | WIRE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal location | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL | - | DUAL |