K3N6C1000F-TC12 datasheet, PDF

Datasheet> All Categories > storage> storage> K3N6C1000F-TC12

K3N6C1000F-TC12: DescriptionMASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44; Categorystorage storage; File Size48KB，3 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

Download Datasheet Parametric Compare View All

K3N6C1000F-TC12 Overview

MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44

K3N6C1000F-TC12 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	TSOP2
package instruction	0.400 INCH, TSOP2-44
Contacts	44
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	120 ns
Spare memory width	8
JESD-30 code	R-PDSO-G44
JESD-609 code	e0
length	18.41 mm
memory density	33554432 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	44
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

Preview

Download Datasheet

View All

K3N6C1000F-TC

32M-Bit (4Mx8 /2Mx16) CMOS MASK ROM

FEATURES

•

Switchable organization

4,194,304x8(byte mode)

2,097,152x16(word mode)

•

Fast access time

100ns(Max.) : C

=50pF

120ns(Max.) : C

=100pF

•

Supply voltage : single +5V

•

Current consumption

Operating : 50mA(Max.)

Standby : 50µA(Max.)

•

Fully static operation

•

All inputs and outputs TTL compatible

•

Three state outputs

•

Package

-. K3N6C1000F-TC : 44-TSOP2-400

CMOS MASK ROM

GENERAL DESCRIPTION

The K3N6C1000F-TC is a fully static mask programmable

ROM fabricated using silicon gate CMOS process technology,

and is organized either as 4,194,304 x 8 bit(byte mode) or as

2,097,152 x 16 bit(word mode) depending on BHE voltage

level.(See mode selection table)

This device operates with a 5V single power supply, and all

inputs and outputs are TTL compatible.

Because of its asynchronous operation, it requires no external

clock assuring extremely easy operation.

It is suitable for use in program memory of microprocessor, and

data memory, character generator.

The K3N6C1000F-TC is packaged in a 44-TSOP2.

FUNCTIONAL BLOCK DIAGRAM

-1

. . .

BHE

CONTROL

LOGIC

BUFFERS

AND

DECODER

MEMORY CELL

MATRIX

(2,097,152x16/

4,194,304x8)

PIN CONFIGURATION

N.C

44 A

43 A

42 A

41 A

40 A

39 A

38 A

37 A

36 A

35 A

BUFFERS

AND

DECODER

SENSE AMP.

BUFFERS

TSOP2

34 A

33 BHE

32 V

31 Q

-1

30 Q

29 Q

28 Q

27 Q

26 Q

25 Q

24 Q

23 V

CE 12

OE 14

Pin Name

- A

- Q

-1

BHE

N.C

Pin Function

Address Inputs

Data Outputs

Output 15(Word mode)/

LSB Address(Byte mode)

Word/Byte selection

Chip Enable

Output Enable

Power (+5V)

Ground

No Connection

K3N6C1000F-TC

K3N6C1000F-TC12 Related Products

	K3N6C1000F-TC12	K3N6C1000F-TC10	K3N6C1000F-TC100	K3N6C1000F-TC15	K3N6C1000F-TC150	K3N6C1000F-TC120
Description	MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	MASK ROM, 2MX16, 150ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	MASK ROM, 2MX16, 150ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	0.400 INCH, TSOP2-44	TSOP2, TSOP44,.46,32	SOP,	TSOP2, TSOP44,.46,32	SOP,	SOP,
Contacts	44	44	44	44	44	44
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	100 ns	100 ns	150 ns	150 ns	120 ns
Spare memory width	8	8	8	8	8	8
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
length	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	SOP	TSOP2	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED	240	240
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	30	30
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm

Recommended Resources

PI-AD20 small power amplifier

LMD18200 is used in speed regulation

cheap light dimmer circuit

Isolated photoelectric input and output working principle diagram

Practical soft start circuit diagram in switching power supply a

I don't understand how people who sell development boards make money~~: Dear seniors, I don't understand how people who sell development boards make money. Just a few boards and then wait for others to buy and collect money?...; 拿得起铁 Buy&Sell

About the problem of checking the synchronization request source of the XC2000 ADC module: In arbitration time slot 3, the arbitrator checks whether there is a synchronization request from other ADC cores. Doesn't this ADC have multiple independent cores? Why does the arbitrator need to che...; 1157421908 Analogue and Mixed Signal

Please tell me about the amplifier: [i=s]This post was last edited by dontium on 2015-1-23 11:42[/i] I want to use another amplifier device to replace OPA347NA SOT23-5, and the performance is required to be similar. I would like to ask ...; 贾维尔麦基 Analogue and Mixed Signal

ADC122S021 timing problem: [i=s] This post was last edited by dontium on 2015-1-23 11:18[/i] uint ADC12_Config(unsigned char temp) { unsigned char i; uint num,tmp=0x000; CS_0; SCLK_1; for(i =0;i<8;i++) { num=temp & 0x80; if(num...; ylsj123456 Analogue and Mixed Signal

Chip packaging quantity and naming rules: 1. DIP dual in-line package DIP (Dual In-line Package) refers to an integrated circuit chip packaged in a dual in-line form. Most small and medium-sized integrated circuits (ICs) use this package form...; rain MCU

How to watch digital TV directly on PC using a set-top box?: How can I use a set-top box to watch digital TV directly on my PC? I am a set-top box game developer. My company has a Java simulator, but no C simulator. So every time I debug the program, I have to ...; yhy_042 Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components