CYStech Electronics Corp.
Surface Mount Glass Passivated Junction Rectifiers
Reverse Voltage 50V to 1000V
Forward Current 1.0A
Spec. No. : C246SA
Issued Date : 2012.08.06
Revised Date : 2013.03.11
Page No. : 1/4
S1A thru S1M
Features
•
For surface mounted applications
•
Glass passivated junction chip
•
Low profile package
•
Built-in stain relief, ideal for automatic placement
•
High temperature soldering guaranteed : 260°C/10 seconds at terminals
•
Plastic material used carries UL flammability classification 94V-0
Mechanical Data
•
Case: JEDEC DO-214AC(SMA) molded plastic
•
Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
•
Polarity: Color band denotes cathode end
•
Mounting position : Any
•
Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or
S1D
200
140
200
Type
S1G
400
280
400
1.1
1
30
5
50
1.8
12
50
90
-55 ~ +150
S1J
600
420
600
S1K
800
560
800
S1M
1000
700
1000
Units
V
V
V
V
A
A
μA
μs
pF
°
C/W
℃
inductive load.
Parameter
For capacitive load, derate current by 20%. )
Symbol
V
RRM
V
RMS
V
R
V
F
I
F(AV)
I
FSM
I
R
trr
C
J
R
θJA
R
θJL
T
J
;T
STG
S1A
50
35
50
S1B
100
70
100
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage, I
F
=1A
Maximum average forward rectified current, see
Fig. 1
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load
(JEDEC method) T
L
=90°C
Maximum DC reverse current at T
A
=25
°
C
Rated DC blocking voltage
T
A
=125
°
C
Typical reverse recovery time
(Note 1)
Typical junction capacitance @ f=1MHz and
applied 4V reverse voltage
Typical thermal resistance
(Note 2)
Operating junction and Storage temperature range
Note: 1.Reverse recovery test conditions : I
F
=0.5A, I
R
=1A, I
RR
=0.25A
2.Thermal resistance from junction to ambient and from junction to lead mounted on PCB with 0.2”×0.2”(5mm×5mm)
copper pad areas.
S1A thru S1M
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5
°C
Spec. No. : C246SA
Issued Date : 2012.08.06
Revised Date : 2013.03.11
Page No. : 3/4
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
S1A thru S1M
CYStek Product Specification
CYStech Electronics Corp.
DO-214AC/SMA Dimension
Spec. No. : C246SA
Issued Date : 2012.08.06
Revised Date : 2013.03.11
Page No. : 4/4
DO-214AC/SMA Plastic
Surface Mounted Package
CYStek Package Code : SA
DIM
A
B
C
D
Inches
Min.
Max.
0.049
0.065
0.100
0.110
0.157
0.177
0.078
0.090
Millimeters
Min.
Max.
1.25
1.65
2.54
2.79
3.99
4.50
1.98
2.29
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.004
0.008
0.030
0.060
0.194
0.208
Millimeters
Min.
Max.
0.15
0.31
0.10
0.20
0.76
1.50
4.91
5.28
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Pure tin plated.
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
S1A thru S1M
CYStek Product Specification
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