CYStech Electronics Corp.
2.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C347SB
Issued Date : 2006.02.07
Revised Date :2011.01.21
Page No. : 1/6
SK2XSB
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
•
Low leakage current
•
High surge capability
•
High temperature soldering: 250°C/10 seconds at terminals
•
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
•
Case: Molded plastic, JEDEC DO-214AA/SMB
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Mounting position: Any
•
Weight: 0.093 gram
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage
@ I
F
=2A
(Note 1)
Maximum average forward rectified
current
Peak forward surge current@ 8.3ms
single half sine wave superimposed on
rated load(JEDEC method)
Maximum DC reverse current@
V
R
=V
RRM
,T
A
=25
℃
(Note 1)
V
R
=V
RRM
,T
A
=125
℃
(Note 1)
Maximum thermal resistance, Junction to
ambient
(Note 2)
Diode junction capacitance@ f=1MHz
and applied 4V reverse voltage
Storage temperature
Operating temperature
Symbols
V
RRM
V
RMS
V
R
V
F
I
O
I
FSM
Type
Units
SK22SB SK24SB SK26SB SK28SB SK2BSB
20
40
60
80
100
V
14
28
42
56
70
V
20
40
60
80
100
V
0.5
0.7
2
50
0.85
V
A
A
I
R
R
th,JA
C
J
Tstg
T
J
0.5
10
40 (typ)
180 (typ)
-65~+150
-65~+125
mA
℃
/W
pF
℃
℃
Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle
2.Mounted on PCB with 0.2”×0.2”mm² (0.5mm×0.5mm) copper pad area.
SK2XSB
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
2.5
Average Forward Current---Io(A)
Peak Forward Surge Current---I
FSM
(A)
Spec. No. : C347SB
Issued Date : 2006.02.07
Revised Date :2011.01.21
Page No. : 2/6
Maximum Non-Repetitive Forward Surge Current
60
50
40
30
20
10
0
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
2
1.5
1
0.5
0
0
50
100
150
200
Ambient Temperature---T
A
(℃)
1
10
Number of Cycles at 60Hz
100
Forward Current vs Forward Voltage
10
Instantaneous Forward Current---I
F
(A)
Junction Capacitance vs Reverse Voltage
700
Junction Capacitance---C
J
(pF)
SK22-SK24
600
500
400
300
200
100
0
1
SK26
SK28-SK2B
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.1
0.01
0.1
0.3
0.5
0.7
0.9
1.1
Forward Voltage---V
F
(V)
1.3
1.5
0.01
0.1
1
10
100
Reverse Voltage---V
R
(V)
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---I
R
(mA)
10
1
Tj=75℃
0.1
Tj=25℃
0.01
0
20
40
60
80
100 120 140
Percent of Rated Peak
Reverse Voltage---(%)
SK2XSB
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C347SB
Issued Date : 2006.02.07
Revised Date :2011.01.21
Page No. : 4/6
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK2XSB
CYStek Product Specification
Microcontroller MCU
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