16 X 4 OTHER FIFO, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 13 MHz |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| memory density | 64 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 16 words |
| character code | 16 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16X4 |
| Exportable | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL/SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum seat height | 5.715 mm |
| Maximum slew rate | 0.17 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| 9403ASDMQB | 9403ADCQR | 9403ADMQB | 9403ALMQB | 9403ALMX | 9403ALCX | 9403ALCQR | 9403ASDCQR | |
|---|---|---|---|---|---|---|---|---|
| Description | 16 X 4 OTHER FIFO, CDIP24 | 16 X 4 OTHER FIFO, CDIP24 | 16X4 OTHER FIFO, CDIP24, CERAMIC, DIP-24 | 16 X 4 OTHER FIFO, CQCC28 | IC 16 X 4 OTHER FIFO, CQCC28, CERAMIC, LCC-28, FIFO | IC 16 X 4 OTHER FIFO, CQCC28, CERAMIC, LCC-28, FIFO | 16 X 4 OTHER FIFO, CQCC28 | 16 X 4 OTHER FIFO, CDIP24 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.6 | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | QCCN, | QCCN, | QCCN, LCC28,.45SQ | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 |
| memory density | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bi |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 28 | 28 | 28 | 28 | 24 |
| word count | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| character code | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| organize | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | QCCN | QCCN | QCCN | QCCN | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL |
| Maximum seat height | 5.715 mm | 4.572 mm | 4.572 mm | 1.93 mm | 1.93 mm | 1.93 mm | 1.93 mm | 5.715 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL |
| width | 7.62 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 7.62 mm |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - | - | incompatible | incompatible |
| Maximum clock frequency (fCLK) | 13 MHz | 19 MHz | 13 MHz | 13 MHz | - | - | 19 MHz | 19 MHz |
| JESD-609 code | e0 | e0 | e0 | e0 | - | - | e0 | e0 |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | - | - | OTHER FIFO | OTHER FIFO |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.6 | DIP24,.6 | LCC28,.45SQ | - | - | LCC28,.45SQ | DIP24,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | - | - | 5 V | 5 V |
| Maximum slew rate | 0.17 mA | 0.17 mA | 0.17 mA | 0.17 mA | - | - | 0.17 mA | 0.17 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
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