9403ALCQR datasheet, PDF - EEWORLD Datasheet

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9403ALCQR: Description16 X 4 OTHER FIFO, CQCC28; Categorystorage storage; File Size943KB，20 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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9403ALCQR Overview

16 X 4 OTHER FIFO, CQCC28

9403ALCQR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCN, LCC28,.45SQ
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	19 MHz
JESD-30 code	S-CQCC-N28
JESD-609 code	e0
length	11.43 mm
memory density	64 bit
Memory IC Type	OTHER FIFO
memory width	4
Number of functions	1
Number of terminals	28
word count	16 words
character code	16
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16X4
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL/SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Maximum seat height	1.93 mm
Maximum slew rate	0.17 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm

9403ALCQR Related Products

	9403ALCQR	9403ADCQR	9403ADMQB	9403ALMQB	9403ALMX	9403ALCX	9403ASDMQB	9403ASDCQR
Description	16 X 4 OTHER FIFO, CQCC28	16 X 4 OTHER FIFO, CDIP24	16X4 OTHER FIFO, CDIP24, CERAMIC, DIP-24	16 X 4 OTHER FIFO, CQCC28	IC 16 X 4 OTHER FIFO, CQCC28, CERAMIC, LCC-28, FIFO	IC 16 X 4 OTHER FIFO, CQCC28, CERAMIC, LCC-28, FIFO	16 X 4 OTHER FIFO, CDIP24	16 X 4 OTHER FIFO, CDIP24
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	QCCN, LCC28,.45SQ	DIP, DIP24,.6	DIP, DIP24,.6	QCCN, LCC28,.45SQ	QCCN,	QCCN,	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	S-CQCC-N28	R-GDIP-T24	R-GDIP-T24	S-CQCC-N28	S-CQCC-N28	S-CQCC-N28	R-GDIP-T24	R-GDIP-T24
memory density	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	64 bi
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	24	24	28	28	28	24	24
word count	16 words	16 words	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16	16	16
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	125 °C	125 °C	125 °C	70 °C	125 °C	70 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4	16X4	16X4
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	DIP	QCCN	QCCN	QCCN	DIP	DIP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL
Maximum seat height	1.93 mm	4.572 mm	4.572 mm	1.93 mm	1.93 mm	1.93 mm	5.715 mm	5.715 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL
width	11.43 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm	11.43 mm	7.62 mm	7.62 mm
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	-	incompatible	incompatible
Maximum clock frequency (fCLK)	19 MHz	19 MHz	13 MHz	13 MHz	-	-	13 MHz	19 MHz
JESD-609 code	e0	e0	e0	e0	-	-	e0	e0
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	-	-	OTHER FIFO	OTHER FIFO
Encapsulate equivalent code	LCC28,.45SQ	DIP24,.6	DIP24,.6	LCC28,.45SQ	-	-	DIP24,.3	DIP24,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	-	-	5 V	5 V
Maximum slew rate	0.17 mA	0.17 mA	0.17 mA	0.17 mA	-	-	0.17 mA	0.17 mA
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED

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