MT47H128M4GB-5EIT:B datasheet, PDF

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MT47H128M4GB-5EIT:B: DescriptionDDR DRAM, 128MX4, 0.6ns, CMOS, PBGA60, 12 X 10 MM, FBGA-60; Categorystorage storage; File Size9MB，139 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT47H128M4GB-5EIT:B Overview

DDR DRAM, 128MX4, 0.6ns, CMOS, PBGA60, 12 X 10 MM, FBGA-60

MT47H128M4GB-5EIT:B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	BGA
package instruction	12 X 10 MM, FBGA-60
Contacts	60
Reach Compliance Code	not_compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	200 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B60
JESD-609 code	e0
length	12 mm
memory density	536870912 bit
Memory IC Type	DDR DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	60
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA60,9X11,32
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	235
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum standby current	0.007 A
Maximum slew rate	0.22 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	10 mm

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512Mb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H128M4 – 32 Meg x 4 x 4 banks

MT47H64M8 – 16 Meg x 8 x 4 banks

MT47H32M16 – 8 Meg x 16 x 4 banks

Features

•

Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

4 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths: 4 or 8

Adjustable data-output drive strength

64ms, 8,192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

Automotive temperature (AT) option

RoHS compliant

Supports JEDEC clock jitter specification

Options

•

Configuration

–

256 Meg x 4 (32 Meg x 4 x 4 banks)

–

128 Meg x 8 (16 Meg x 8 x 4 banks)

–

64 Meg x 16 (8 Meg x 16 x 4 banks)

•

FBGA package (Pb-free) – x16

–

84-ball FBGA (12mm x 12.5mm) Rev. B

–

84-ball FBGA (10mm x 12.5mm) Rev. D

–

84-ball FBGA (8mm x 12.5mm) Rev. F

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (12mm x 10mm) Rev. B

–

60-ball FBGA (10mm x 10mm) Rev. D

–

60-ball FBGA (8mm x 10mm) Rev. F

•

FBGA package (lead solder) – x16

–

84-ball FBGA (12mm x 12.5mm) Rev. B

–

84-ball FBGA (10mm x 12.5mm) Rev. D

–

84-ball FBGA (8mm x 12.5mm) Rev. F

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (12mm x 10mm) Rev. B

–

60-ball FBGA (10mm x 10mm) Rev. D

–

60-ball FBGA (8mm x 10mm) Rev. F

•

Timing – cycle time

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3.0ns @ CL = 4 (DDR2-667)

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

–

5.0ns @ CL = 3 (DDR2-400)

•

Self refresh

–

Standard

–

Low-power

•

Operating temperature

–

Commercial (0°C

≤

85°C)

–

Industrial (–40°C

≤

95°C;

–40°C

≤

85°C)

–

Automotive, Revision :D only

(–40°C

≤

, T

≤

105°C)

•

Revision

Note:

Marking

128M4

64M8

32M16

-25E

-25

-3E

-3

-37E

-5E

None

:B/:D/:F

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

PDF: 09005aef82f1e6e2

Rev. M 9/08 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Industrial Temperature .............................................................................................................................. 10

Automotive Temperature ........................................................................................................................... 11

General Notes ............................................................................................................................................ 11

Functional Block Diagrams ............................................................................................................................. 12

Ball Assignments and Descriptions ................................................................................................................. 15

Packaging ...................................................................................................................................................... 20

Package Dimensions .................................................................................................................................. 20

FBGA Package Capacitance ......................................................................................................................... 26

Electrical Specifications – Absolute Ratings ..................................................................................................... 27

Temperature and Thermal Impedance ........................................................................................................ 27

Electrical Specifications – Idd Parameters ........................................................................................................ 30

Idd Specifications and Conditions ............................................................................................................... 30

Idd7 Conditions ......................................................................................................................................... 31

AC Timing Operating Specifications ................................................................................................................ 35

AC and DC Operating Conditions .................................................................................................................... 46

ODT DC Electrical Characteristics ................................................................................................................... 47

Input Electrical Characteristics and Operating Conditions ............................................................................... 48

Output Electrical Characteristics and Operating Conditions ............................................................................. 51

Output Driver Characteristics ......................................................................................................................... 53

Power and Ground Clamp Characteristics ....................................................................................................... 57

AC Overshoot/Undershoot Specification ......................................................................................................... 58

Input Slew Rate Derating ................................................................................................................................ 60

Commands .................................................................................................................................................... 74

Truth Tables ............................................................................................................................................... 74

DESELECT ................................................................................................................................................. 78

NO OPERATION (NOP) .............................................................................................................................. 79

LOAD MODE (LM) ..................................................................................................................................... 79

ACTIVATE .................................................................................................................................................. 79

READ ......................................................................................................................................................... 79

WRITE ....................................................................................................................................................... 79

PRECHARGE .............................................................................................................................................. 80

REFRESH ................................................................................................................................................... 80

SELF REFRESH ........................................................................................................................................... 80

Mode Register (MR) ........................................................................................................................................ 80

Burst Length .............................................................................................................................................. 81

Burst Type ................................................................................................................................................. 81

Operating Mode ......................................................................................................................................... 83

DLL RESET ................................................................................................................................................. 83

Write Recovery ........................................................................................................................................... 84

Power-Down Mode .................................................................................................................................... 84

CAS Latency (CL) ........................................................................................................................................ 85

Extended Mode Register (EMR) ....................................................................................................................... 86

DLL Enable/Disable ................................................................................................................................... 87

Output Drive Strength ................................................................................................................................ 87

DQS# Enable/Disable ................................................................................................................................. 87

RDQS Enable/Disable ................................................................................................................................. 87

Output Enable/Disable ............................................................................................................................... 87

On-Die Termination (ODT) ........................................................................................................................ 88

Contents

PDF: 09005aef82f1e6e2

Rev. M 9/08 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 88

Posted CAS Additive Latency (AL) ............................................................................................................... 88

Extended Mode Register 2 (EMR2) .................................................................................................................. 90

Extended Mode Register 3 (EMR3) .................................................................................................................. 91

Initialization .................................................................................................................................................. 92

ACTIVATE ...................................................................................................................................................... 96

READ ............................................................................................................................................................. 98

READ with Precharge ................................................................................................................................ 102

READ with Auto Precharge ......................................................................................................................... 104

WRITE .......................................................................................................................................................... 109

PRECHARGE ................................................................................................................................................. 119

REFRESH ...................................................................................................................................................... 120

SELF REFRESH .............................................................................................................................................. 121

Power-Down Mode ....................................................................................................................................... 123

Precharge Power-Down Clock Frequency Change .......................................................................................... 130

Reset ............................................................................................................................................................. 131

CKE Low Anytime ...................................................................................................................................... 131

ODT Timing .................................................................................................................................................. 133

MRS Command to ODT Update Delay ........................................................................................................ 135

PDF: 09005aef82f1e6e2

Rev. M 9/08 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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