The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
NEW
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections
FX11L Series
sFeatures
1. Low Profile Design
The board to board mating height of 2 mm suits smaller,thinner
case designs.
qCross-Section
of Mating
2. Improved Transmission Efficiency Between
Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
4. Reinforced Fittings for Added Solder Weld
Strength
Reinforced fittings provide greater adhesion to the
board,protecting against peeling.The unique connector
design provides a connection between the fitting and the
ground plate for a stronger ground.
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
Detailed Figure of Solder Gap
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
7. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height.
sApplications
Notebook computers, PDA, and other miniature electronic equipment.
2003.7
1
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
sProduct
Specifications
Rated current 0.3 A (Note 1) Operating temperature range -55 to 85ç
Rating Rated voltage 50 V AC
Operating humidity range
(No condensation)
Item
1. Insulation resistance
2. Voltage proof
3. Contact resistance
4. Vibration
5. Shock
6. Damp heat
(Steady state)
7. Rapid change
of temperature
8. Insertion/
Withdrawal life
9. Resistance to
soldering heat
100 Mø or greater
No flashover or breakdown
60 mø or less
No electrical discontinuity for 1µs or greater
No damage, cracks, or parts looseness
No electrical discontinuity for 1µs or longer
No damage, cracks, or parts looseness
Contact resistance of 70 mø or less, insulation resistance of
100 Mø or greater, no damage, cracks, or parts looseness
Contact resistance of 70 mø or less, insulation resistance of
100 Mø or greater, no damage, cracks, or parts looseness
Contact resistance of 70 mø or less
No damage, cracks, or parts looseness
No melting of resin portion which affects performance
Storage temperature range -10 to +60ç (Note 2)
-40
to
-70%
(Note 2)
Relative humidity 95% or less Storage humidity range
Requirements
Measured at 100 V DC
Conditions
150 V AC applied for one minute
Measured at 100 mA
Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions,
10 cycles each
Acceleration of 490 m/s
2
, 11ms duration, sine half-wave
waveform,for 3 cycles in the both directions of each of the 3 axes
Temperature of 40ç, humidity of 90 to 95%, duration 96 h
Temperature: -55ç
¡
15 to 35ç
¡
85ç
¡
15 to 35ç
Time: 30 min.
¡
2 to 3 min.
¡
30 min.
¡
2 to 3 min. for 5 cycles
50 times
Reflow: At the recommended temperature profile
Soldering iron temperature: 300ç for 3 seconds
Note 1: Please contact us when connector application exceeds 0.3 A rated current.
Note 2: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
Note 3: The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.
sMaterials
Part
Insulator
Contacts
Ground plate
Reinforced fitting
Reinforced plate
Material
LCP resin
Copper alloy
Phosphor bronze
Phosphor bronze
Phosphor bronze
Beige
Header
Receptacle
Solder plating
Tin plating
Engagement Area: Gold plating of 0.1µm
Termination Area: Flash plating
Process
UL Rating
UL94V-0
----------
----------
----------
----------
Note : The black dots on the insulater will not affect performance.
sProduct
Number Configuration
Please use this information to discern the product specifications from the product number codes.
To order, please select from the product number codes listed in tables on pages 3 to 6 of this catalog.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
3 Not required in products without guideposts.
3
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
0.25
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 Cross-hatched portions, totaling 2 places, indicate the reinforced fittings.
3 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
4 Not required in products without guideposts.
4
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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Embedded System
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