1337AGCSRGI datasheet, PDF - EEWORLD Datasheet

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1337AGCSRGI: DescriptionSOIC-16, Tube; CategoryThe embedded processor and controller Microcontrollers and processors; File Size396KB，27 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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1337AGCSRGI Overview

SOIC-16, Tube

1337AGCSRGI Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	SOIC
package instruction	SOP, SOP16,.4
Contacts	16
Manufacturer packaging code	PIG16
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Description	SOIC 300 MIL
maximum clock frequency	0.032 MHz
Information access methods	I2C
interrupt capability	Y
JESD-30 code	R-PDSO-G16
JESD-609 code	e3
length	10.3 mm
Humidity sensitivity level	3
Number of terminals	16
Number of timers	1
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
shortest time	SECONDS
Maximum time at peak reflow temperature	30
Volatile	YES
width	7.5 mm
uPs/uCs/peripheral integrated circuit type	TIMER, REAL TIME CLOCK

1337AGCSRGI Preview

DATASHEET

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

General Description

The IDT1337AG device is a low-power serial real-time clock

(RTC) device with two programmable time-of-day alarms

and a programmable square-wave output. Address and

data are transferred serially through an I

C bus. The device

provides seconds, minutes, hours, day, date, month, and

year information. The date at the end of the month is

automatically adjusted for months with fewer than 31 days,

including corrections for leap year. The clock operates in

either the 24-hour or 12-hour format with AM/PM indicator.

IDT1337AG

Features

•

Real-Time Clock (RTC) counts seconds, minutes, hours,

day, date, month, and year with leap-year compensation

valid up to 2100

•

Packaged in 8-pin MSOP, 8-pin SOIC, or 16-pin SOIC

(surface-mount package with an integrated crystal)

Applications

•

Telecommunication (Routers, Switches, Servers)

Handhelds (GPS, POS terminals, MP3 players)

Set-Top Box, Digital Recording,

Office (Fax/Printers, Copiers)

Medical (Glucometer, Medicine Dispensers)

Other (Thermostats, Vending Machines, Modems, Utility

Meters, Digital Photo Frame devices)

•

C serial interface (Normal and Fast modes)

Two time-of-day alarms

Oscillator stop flag

Programmable square-wave output defaults to 32kHz on

power-up

•

Operating voltage of 1.8 to 5.5V

•

Industrial temperature range (-40 to +85°C)

Block Diagram

VCC

Crystal inside package

for 16-pin SOIC ONLY

1 Hz/4.096 kHz/

8.192 kHz/32.768 kHz

32.768 kHz

Oscillator and

Divider

MUX/

Buffer

SQW/INTB

INTA

Control

Logic

Clock,

Calendar

Counter

SCL

SDA

Interface

1 Byte

Control

7 Bytes

Buffer

Alarm

Registers

GND

IDT®

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

IDT1337AG

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IDT1337AG

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

RTC

Pin Assignment

(8-pin MSOP/SOIC)

INTA

GND

IDT1337AG

VCC

SQW/INTB

SCL

SDA

Pin Assignment

(16-pin SOIC)

SCL

SQW/INTB

VCC

SDA

GND

INTA

IDT1337AG

IDT®

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

IDT1337AG

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IDT1337AG

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

RTC

Pin Descriptions

Pin Number

MSOP SOIC

—

Name

Pin Description/Function

Connections for standard 32.768 kHz quartz crystal. The internal oscillator

circuitry is designed for operation with a crystal having a specified load

capacitance (CL) of 7 pF. An external 32.768 kHz oscillator can also drive the

IDT1337AG. In this configuration, the X1 pin is connected to the external

oscillator signal and the X2 pin is left floating.

Interrupt output. When enabled, INTA is asserted low when the time/day/date

matches the values set in the alarm registers. This pin is an open-drain output

and requires an external pull-up resistor (10 k typical).

Connect to ground. DC power is provided to the device on these pins.

Serial data input/output. SDA is the input/output pin for the I

C serial interface.

The SDA pin is an open-drain output and requires an external pull-up resistor

(2 k typical).

Serial clock input. SCL is used to synchronize data movement on the serial

interface. The SCL pin is an open-drain output and requires an external pull-up

resistor (2 k typical).

INTA

GND

SDA

SCL

Square-Wave/Interrupt output. Programmable square-wave or interrupt output

signal. The SQW/INT pin is an open-drain output and requires an external

SQW/INTB

pull-up resistor (10 k typical). This pin can also function as an additional

interrupt pin under certain conditions (see page 6 for details).

VCC

Primary power supply. DC power is applied to this pin.

No connect. These pins are unused and must be connected to ground.

—

4 - 13

IDT®

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C SERIAL INTERFACE

IDT1337AG

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IDT1337AG

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C SERIAL INTERFACE

RTC

Typical Operating Circuit

CRYSTAL

CPU

SCL

SDA

SQW/INTB

10k

IDT1337AG

GND

INTA

Detailed Description

Communications to and from the IDT1337AG occur serially

over an I

C bus. The IDT1337AG operates as a slave device

on the serial bus. Access is obtained by implementing a

START condition and providing a device identification code,

followed by data. Subsequent registers can be accessed

sequentially until a STOP condition is executed. The device

is fully accessible through the I

C interface whenever VCC

is between 5.5 V and 1.8 V. I

C operation is not guaranteed

when VCC is below 1.8 V. The IDT1337AG maintains the

time and date when VCC is as low as 1.3 V.

The following sections discuss in detail the Oscillator block,

Clock/Calendar Register Block and Serial I

C block.

Effective Load Capacitance

Please see diagram below for effective load capacitance

calculation. The effective load capacitance (CL) should

match the recommended load capacitance of the crystal in

order for the crystal to oscillate at its specified parallel

resonant frequency with 0ppm frequency error.

Oscillator Block

Selection of the right crystal, correct load capacitance and

careful PCB layout are important for a stable crystal

oscillator. Due to the optimization for the lowest possible

current in the design for these oscillators, losses caused by

parasitic currents can have a significant impact on the

overall oscillator performance. Extra care needs to be taken

to maintain a certain quality and cleanliness of the PCB.

Crystal Selection

The key parameters when selecting a 32 kHz crystal to work

with IDT1337AG RTC are:

•

Recommended Load Capacitance

•

Crystal Effective Series Resistance (ESR)

•

Frequency Tolerance

In the above figure, X1 and X2 are the crystal pins of our

device. Cin1 and Cin2 are the internal capacitors which

include the X1 and X2 pin capacitance. Cex1 and Cex2 are

the external capacitors that are needed to tune the crystal

frequency. Ct1 and Ct2 are the PCB trace capacitances

between the crystal and the device pins. CS is the shunt

capacitance of the crystal (as specified in the crystal

manufacturer's datasheet or measured using a network

analyzer).

IDT®

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

IDT1337AG

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IDT1337AG

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

RTC

Note:

IDT1337AGCSRI integrates a standard 32.768 kHz

crystal in the package and contributes an additional

frequency error of 10ppm at nominal

(+3.3 V) and

+25°C.

to the GND layer. This helps to keep noise generated by

the oscillator circuit locally on this separated island. The

ground connections for the load capacitors and the

oscillator should be connected to this island.

ESR (Effective Series Resistance)

Choose the crystal with lower ESR. A low ESR helps the

crystal to start up and stabilize to the correct output

frequency faster compared to high ESR crystals.

PCB Layout

Frequency Tolerance

The frequency tolerance for 32 kHz crystals should be

specified at nominal temperature (+25°C) on the crystal

manufacturer datasheet. The crystals used with IDT1337AG

typically have a frequency tolerance of +/-20ppm at +25°C.

Specifications for a typical 32 kHz crystal used with our

device are shown in the table below.

Parameter

Nominal Freq.

Series Resistance

Load Capacitance

1337AG

Symbol

ESR

Min

Typ

32.768

Max Units

kHz

k

PCB Assembly, Soldering and Cleaning

Board-assembly production process and assembly quality

can affect the performance of the 32kHz oscillator.

Depending on the flux material used, the soldering process

can leave critical residues on the PCB surface. High

humidity and fast temperature cycles that cause humidity

condensation on the printed circuit board can create

process residuals. These process residuals cause the

insulation of the sensitive oscillator signal lines towards

each other and neighboring signals on the PCB to decrease.

High humidity can lead to moisture condensation on the

surface of the PCB and, together with process residuals,

reduce the surface resistivity of the board. Flux residuals on

the board can cause leakage current paths, especially in

humid environments. Thorough PCB cleaning is therefore

highly recommended in order to achieve maximum

performance by removing flux residuals from the board after

assembly. In general, reduction of losses in the oscillator

circuit leads to better safety margin and reliability.

PCB Design Consideration

•

Signal traces between IDT device pins and the crystal

must be kept as short as possible. This minimizes

parasitic capacitance and sensitivity to crosstalk and

EMI. Note that the trace capacitances play a role in the

effective crystal load capacitance calculation.

•

Data lines and frequently switching signal lines should be

routed as far away from the crystal connections as

possible. Crosstalk from these signals may disturb the

oscillator signal.

•

Reduce the parasitic capacitance between X1 and X2

signals by routing them as far apart as possible.

•

The oscillation loop current flows between the crystal and

the load capacitors. This signal path (crystal to CL1 to

CL2 to crystal) should be kept as short as possible and

ideally be symmetric. The ground connections for both

capacitors should be as close together as possible.

Never route the ground connection between the

capacitors all around the crystal, because this long

ground trace is sensitive to crosstalk and EMI.

•

To reduce the radiation / coupling from oscillator circuit,

an isolated ground island on the GND layer could be

made. This ground island can be connected at one point

IDT®

REAL-TIME CLOCK WITH I

C SERIAL INTERFACE

IDT1337AG

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1337AGCSRGI Related Products

	1337AGCSRGI	1337AGCSRGI8	1337AGDVGI8	1337AGDVGI
Description	SOIC-16, Tube	SOIC-16, Reel	TSSOP-8, Reel	TSSOP-8, Tube
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	SOIC	SOIC	TSSOP	TSSOP
package instruction	SOP, SOP16,.4	SOP, SOP16,.4	TSSOP, TSSOP8,.19	TSSOP, TSSOP8,.19
Contacts	16	16	8	8
Manufacturer packaging code	PIG16	PIG16	DVG8	DVG8
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Samacsys Description	SOIC 300 MIL	SOIC 300 MIL	TSSOP 3.0MM BODY; 0.65MM PITCH	TSSOP 3.0MM BODY; 0.65MM PITCH
maximum clock frequency	0.032 MHz	0.032 MHz	0.032 MHz	0.032 MHz
Information access methods	I2C	I2C	I2C	I2C
interrupt capability	Y	Y	Y	Y
JESD-30 code	R-PDSO-G16	R-PDSO-G16	S-PDSO-G8	S-PDSO-G8
JESD-609 code	e3	e3	e3	e3
length	10.3 mm	10.3 mm	3 mm	3 mm
Humidity sensitivity level	3	3	3	3
Number of terminals	16	16	8	8
Number of timers	1	1	1	1
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	TSSOP	TSSOP
Encapsulate equivalent code	SOP16,.4	SOP16,.4	TSSOP8,.19	TSSOP8,.19
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	2.65 mm	1.1 mm	1.1 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
shortest time	SECONDS	SECONDS	SECONDS	SECONDS
Maximum time at peak reflow temperature	30	30	30	30
Volatile	YES	YES	YES	YES
width	7.5 mm	7.5 mm	3 mm	3 mm
uPs/uCs/peripheral integrated circuit type	TIMER, REAL TIME CLOCK	TIMER, REAL TIME CLOCK	TIMER, REAL TIME CLOCK	TIMER, REAL TIME CLOCK

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