TC544000F-12(TP2) datasheet, PDF

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TC544000F-12(TP2): DescriptionIC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM; Categorystorage storage; File Size324KB，12 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC544000F-12(TP2) Overview

IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM

TC544000F-12(TP2) Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	SOIC
package instruction	SOP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	120 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.6 mm
memory density	4194304 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	2.8 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.7 mm

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TC544000F-12(TP2) Related Products

	TC544000F-12(TP2)	TC544000F-12(EL)	TC544000F-120(EL)	TC544000F-150(TP1)	TC544000F-150(EL)	TC544000F-12(TP1)	TC544000F-120(TP1)	TC544000F-120(TP2)	TC544000F-150(TP2)
Description	IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM	IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maker	Toshiba Semiconductor	-	-	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
Maximum access time	120 ns	120 ns	120 ns	150 ns	-	-	120 ns	-	-
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	-	-	R-PDSO-G32	-	-
JESD-609 code	e0	e0	e0	e0	-	-	e0	-	-
length	20.6 mm	20.6 mm	20.6 mm	20.6 mm	-	-	20.6 mm	-	-
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	-	-	4194304 bit	-	-
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	-	-	OTP ROM	-	-
memory width	8	8	8	8	-	-	8	-	-
Number of functions	1	1	1	1	-	-	1	-	-
Number of terminals	32	32	32	32	-	-	32	-	-
word count	524288 words	524288 words	524288 words	524288 words	-	-	524288 words	-	-
character code	512000	512000	512000	512000	-	-	512000	-	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	-	ASYNCHRONOUS	-	-
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	-	-	70 °C	-	-
organize	512KX8	512KX8	512KX8	512KX8	-	-	512KX8	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	-	3-STATE	-	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	-	-
encapsulated code	SOP	SOP	SOP	SOP	-	-	SOP	-	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	-	-
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	-	SMALL OUTLINE	-	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	-	PARALLEL	-	-
Peak Reflow Temperature (Celsius)	240	240	240	240	-	-	240	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	-	-
Maximum seat height	2.8 mm	2.8 mm	2.8 mm	2.8 mm	-	-	2.8 mm	-	-
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.5 V	5.5 V	-	-	5.5 V	-	-
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.5 V	4.5 V	-	-	4.5 V	-	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	-	-	5 V	-	-
surface mount	YES	YES	YES	YES	-	-	YES	-	-
technology	CMOS	CMOS	CMOS	CMOS	-	-	CMOS	-	-
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	-	COMMERCIAL	-	-
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	-	TIN LEAD	-	-
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	-	-	GULL WING	-	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	-	1.27 mm	-	-
Terminal location	DUAL	DUAL	DUAL	DUAL	-	-	DUAL	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	-	-
width	10.7 mm	10.7 mm	10.7 mm	10.7 mm	-	-	10.7 mm	-	-

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