IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| TC544000F-12(TP1) | TC544000F-12(EL) | TC544000F-120(EL) | TC544000F-150(TP1) | TC544000F-150(EL) | TC544000F-12(TP2) | TC544000F-120(TP1) | TC544000F-120(TP2) | TC544000F-150(TP2) | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maker | Toshiba Semiconductor | - | - | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Maximum access time | - | 120 ns | 120 ns | 150 ns | - | 120 ns | 120 ns | - | - |
| JESD-30 code | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | - | R-PDSO-G32 | R-PDSO-G32 | - | - |
| JESD-609 code | - | e0 | e0 | e0 | - | e0 | e0 | - | - |
| length | - | 20.6 mm | 20.6 mm | 20.6 mm | - | 20.6 mm | 20.6 mm | - | - |
| memory density | - | 4194304 bit | 4194304 bit | 4194304 bit | - | 4194304 bit | 4194304 bit | - | - |
| Memory IC Type | - | OTP ROM | OTP ROM | OTP ROM | - | OTP ROM | OTP ROM | - | - |
| memory width | - | 8 | 8 | 8 | - | 8 | 8 | - | - |
| Number of functions | - | 1 | 1 | 1 | - | 1 | 1 | - | - |
| Number of terminals | - | 32 | 32 | 32 | - | 32 | 32 | - | - |
| word count | - | 524288 words | 524288 words | 524288 words | - | 524288 words | 524288 words | - | - |
| character code | - | 512000 | 512000 | 512000 | - | 512000 | 512000 | - | - |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | - |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | - | - |
| organize | - | 512KX8 | 512KX8 | 512KX8 | - | 512KX8 | 512KX8 | - | - |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | - |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| encapsulated code | - | SOP | SOP | SOP | - | SOP | SOP | - | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - |
| Package form | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | - | - |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | - | - |
| Peak Reflow Temperature (Celsius) | - | 240 | 240 | 240 | - | 240 | 240 | - | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | - |
| Maximum seat height | - | 2.8 mm | 2.8 mm | 2.8 mm | - | 2.8 mm | 2.8 mm | - | - |
| Maximum supply voltage (Vsup) | - | 5.25 V | 5.5 V | 5.5 V | - | 5.25 V | 5.5 V | - | - |
| Minimum supply voltage (Vsup) | - | 4.75 V | 4.5 V | 4.5 V | - | 4.75 V | 4.5 V | - | - |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V | 5 V | - | - |
| surface mount | - | YES | YES | YES | - | YES | YES | - | - |
| technology | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | - | - |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | - |
| Terminal surface | - | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | - | - |
| Terminal form | - | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | - | - |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | - | - |
| Terminal location | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | - | - |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - |
| width | - | 10.7 mm | 10.7 mm | 10.7 mm | - | 10.7 mm | 10.7 mm | - | - |