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TC544000F-150(TP2)

Description
IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM
Categorystorage    storage   
File Size324KB,12 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC544000F-150(TP2) Overview

IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM

TC544000F-150(TP2) Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeSOIC
package instructionSOP,
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99

TC544000F-150(TP2) Related Products

TC544000F-150(TP2) TC544000F-12(EL) TC544000F-120(EL) TC544000F-150(TP1) TC544000F-150(EL) TC544000F-12(TP2) TC544000F-12(TP1) TC544000F-120(TP1) TC544000F-120(TP2)
Description IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 OTPROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC
package instruction SOP, SOP, SOP, SOP, SOP, SOP, SOP, SOP, SOP,
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maker Toshiba Semiconductor - - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
Maximum access time - 120 ns 120 ns 150 ns - 120 ns - 120 ns -
JESD-30 code - R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 - R-PDSO-G32 - R-PDSO-G32 -
JESD-609 code - e0 e0 e0 - e0 - e0 -
length - 20.6 mm 20.6 mm 20.6 mm - 20.6 mm - 20.6 mm -
memory density - 4194304 bit 4194304 bit 4194304 bit - 4194304 bit - 4194304 bit -
Memory IC Type - OTP ROM OTP ROM OTP ROM - OTP ROM - OTP ROM -
memory width - 8 8 8 - 8 - 8 -
Number of functions - 1 1 1 - 1 - 1 -
Number of terminals - 32 32 32 - 32 - 32 -
word count - 524288 words 524288 words 524288 words - 524288 words - 524288 words -
character code - 512000 512000 512000 - 512000 - 512000 -
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS - ASYNCHRONOUS -
Maximum operating temperature - 70 °C 70 °C 70 °C - 70 °C - 70 °C -
organize - 512KX8 512KX8 512KX8 - 512KX8 - 512KX8 -
Output characteristics - 3-STATE 3-STATE 3-STATE - 3-STATE - 3-STATE -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY -
encapsulated code - SOP SOP SOP - SOP - SOP -
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR - RECTANGULAR -
Package form - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE - SMALL OUTLINE -
Parallel/Serial - PARALLEL PARALLEL PARALLEL - PARALLEL - PARALLEL -
Peak Reflow Temperature (Celsius) - 240 240 240 - 240 - 240 -
Certification status - Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified -
Maximum seat height - 2.8 mm 2.8 mm 2.8 mm - 2.8 mm - 2.8 mm -
Maximum supply voltage (Vsup) - 5.25 V 5.5 V 5.5 V - 5.25 V - 5.5 V -
Minimum supply voltage (Vsup) - 4.75 V 4.5 V 4.5 V - 4.75 V - 4.5 V -
Nominal supply voltage (Vsup) - 5 V 5 V 5 V - 5 V - 5 V -
surface mount - YES YES YES - YES - YES -
technology - CMOS CMOS CMOS - CMOS - CMOS -
Temperature level - COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL - COMMERCIAL -
Terminal surface - TIN LEAD TIN LEAD TIN LEAD - TIN LEAD - TIN LEAD -
Terminal form - GULL WING GULL WING GULL WING - GULL WING - GULL WING -
Terminal pitch - 1.27 mm 1.27 mm 1.27 mm - 1.27 mm - 1.27 mm -
Terminal location - DUAL DUAL DUAL - DUAL - DUAL -
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED -
width - 10.7 mm 10.7 mm 10.7 mm - 10.7 mm - 10.7 mm -
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