Standard SRAM, 256X1, 7ns, ECL, CDIP16, HERMETIC SEALED, METAL CAP, CERAMIC, DIP-16
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 7 ns |
| JESD-30 code | R-CDIP-T16 |
| JESD-609 code | e0 |
| length | 20.066 mm |
| memory density | 256 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 256X1 |
| Output characteristics | OPEN-EMITTER |
| Exportable | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.064 mm |
| Maximum slew rate | 0.14 mA |
| surface mount | NO |
| technology | ECL |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| F10414DC | F10414FC | |
|---|---|---|
| Description | Standard SRAM, 256X1, 7ns, ECL, CDIP16, HERMETIC SEALED, METAL CAP, CERAMIC, DIP-16 | Standard SRAM, 256X1, 7ns, ECL, CDFP16, CERPACK-16 |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Fairchild | Fairchild |
| Parts packaging code | DIP | DFP |
| package instruction | DIP, DIP16,.3 | DFP, FL16,.3 |
| Contacts | 16 | 16 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 7 ns | 7 ns |
| JESD-30 code | R-CDIP-T16 | R-GDFP-F16 |
| JESD-609 code | e0 | e0 |
| length | 20.066 mm | 9.906 mm |
| memory density | 256 bit | 256 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 |
| Negative supply voltage rating | -5.2 V | -5.2 V |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 16 | 16 |
| word count | 256 words | 256 words |
| character code | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C | 75 °C |
| organize | 256X1 | 256X1 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER |
| Exportable | NO | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DFP |
| Encapsulate equivalent code | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 4.064 mm | 2.159 mm |
| Maximum slew rate | 0.14 mA | 0.14 mA |
| surface mount | NO | YES |
| technology | ECL | ECL |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 6.6675 mm |
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