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NM27C040N100

Description
OTP ROM, 512KX8, 100ns, CMOS, PDIP32, PLASTIC, DIP-32
Categorystorage    storage   
File Size111KB,11 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

NM27C040N100 Overview

OTP ROM, 512KX8, 100ns, CMOS, PDIP32, PLASTIC, DIP-32

NM27C040N100 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.912 mm
memory density4194304 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.334 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
NM27C040 4,194,304-Bit (512K x 8) High Performance CMOS EPROM
February 1999
NM27C040
4,194,304-Bit (512K x 8) High Performance
CMOS EPROM
General Description
The NM27C040 is a high performance, 4,194,304-bit Electrically
Programmable UV Erasable Read Only Memory. It is organized
as 512K words of 8 bits each. Its pin-compatibility with byte-wide
JEDEC EPROMs enables upgrades through 8 Mbit EPROMs.
The “Don’t Care” feature on V
PP
during read operations allows
memory expansions from 1M to 8 Mbits with no printed circuit
board changes.
The NM27C040 provides microprocessor-based systems exten-
sive storage capacity for large portions of operating system and
application software. Its 120ns access time provides high speed
operation with high-performance CPUs. The NM27C040 offers a
single chip solution for the code storage requirements of 100%
firmware-based equipment. Frequently used software routines
are quickly executed from EPROM storage, greatly enhancing
system utility.
The NM27C040 is manufactured using Fairchild’s advanced
CMOS AMG™ EPROM technology.
Features
s
High performance CMOS
— 120, 150ns access time*
s
Simplified upgrade path
—V
PP
is a “Don’t Care” during normal read operation
s
Manufacturer’s identification code
s
JEDEC standard pin configuration
— 32-pin PDIP
— 32-pin PLCC
— 32-pin CERDIP
*Note:
New revision meets 70ns. Please check with factory for availability.
Block Diagram
VCC
GND
VPP
OE
CE/PGM
Output Enable,
Chip Enable, and
Program Logic
Data Outputs O0 - O7
Output
Buffers
Y Decoder
..
Y Gating
A0 - A18
Address
Inputs
.......
4,194,304-Bit
Cell Matrix
X Decoder
DS010836-1
AMG™ is a trademark of WSI, Inc.
© 1999 Fairchild Semiconductor Corporation
NM27C040 Rev. C.1
1
www.fairchildsemi.com

NM27C040N100 Related Products

NM27C040N100 NM27C040N200 NM27C040Q100 NM27C040VE150 NM27C040QE120 NM27C040V100 NM27C040NE120 NM27C040VE120 NM27C040NE150
Description OTP ROM, 512KX8, 100ns, CMOS, PDIP32, PLASTIC, DIP-32 OTP ROM, 512KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 UVPROM, 512KX8, 100ns, CMOS, CDIP32, WINDOWED, CERDIP-32 OTP ROM, 512KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 UVPROM, 512KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 OTP ROM, 512KX8, 100ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 512KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 OTP ROM, 512KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32
Parts packaging code DIP DIP DIP QFJ DIP QFJ DIP QFJ DIP
package instruction DIP, DIP32,.6 DIP, WDIP, DIP32,.6 QCCJ, LDCC32,.5X.6 WDIP, DIP32,.6 QCCJ, LDCC32,.5X.6 DIP, DIP32,.6 QCCJ, LDCC32,.5X.6 DIP, DIP32,.6
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknow unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 120 ns 100 ns 150 ns 120 ns 100 ns 120 ns 120 ns 150 ns
JESD-30 code R-PDIP-T32 R-PDIP-T32 R-GDIP-T32 R-PQCC-J32 R-GDIP-T32 R-PQCC-J32 R-PDIP-T32 R-PQCC-J32 R-PDIP-T32
memory density 4194304 bit 4194304 bi 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type OTP ROM OTP ROM UVPROM OTP ROM UVPROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - - -40 °C -40 °C - -40 °C -40 °C -40 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP WDIP QCCJ WDIP QCCJ DIP QCCJ DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE, WINDOW CHIP CARRIER IN-LINE, WINDOW CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.334 mm 5.334 mm 5.969 mm 3.56 mm 5.969 mm 3.56 mm 5.334 mm 3.56 mm 5.334 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES NO YES NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE J BEND THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL QUAD DUAL QUAD DUAL QUAD DUAL
width 15.24 mm 15.24 mm 15.24 mm 11.455 mm 15.24 mm 11.455 mm 15.24 mm 11.455 mm 15.24 mm
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Fairchild - - Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
I/O type COMMON - COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-609 code e0 - e0 e0 e0 e0 e0 e0 e0
length 41.912 mm 41.912 mm - 13.995 mm - 13.995 mm 41.912 mm 13.995 mm 41.912 mm
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Encapsulate equivalent code DIP32,.6 - DIP32,.6 LDCC32,.5X.6 DIP32,.6 LDCC32,.5X.6 DIP32,.6 LDCC32,.5X.6 DIP32,.6
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Maximum standby current 0.0001 A - 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA - 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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