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IS64WV12816BLL-15BA3

Description
Standard SRAM, 128KX16, 15ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48
Categorystorage    storage   
File Size116KB,15 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS64WV12816BLL-15BA3 Overview

Standard SRAM, 128KX16, 15ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48

IS64WV12816BLL-15BA3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeBGA
package instructionTFBGA, BGA48,6X8,30
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time15 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length8 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize128KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Certification statusNot Qualified
Filter levelAEC-Q100
Maximum seat height1.2 mm
Maximum standby current0.006 A
Minimum standby current2.5 V
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width6 mm
IS61WV12816BLL
IS64WV12816BLL
128K x 16 HIGH-SPEED CMOS STATIC RAM
ISSI
FEBRUARY 2006
®
FEATURES
• High-speed access time:
12 ns: 3.3V + 10%
15 ns: 2.5V-3.6V
• Operating Current: 25mA (typ.)
• Stand by Current: 400µA(typ.)
• TTL and CMOS compatible interface levels
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Industrial and Automotive temperatures avail-
able
• Lead-free available
DESCRIPTION
The
ISSI
IS61WV12816BLL and IS64WV12816BLL are
high-speed, 2,097,152-bit static RAM organized as 131,072
words by 16 bits. They are fabricated using
ISSI
's high-
performance CMOS technology. This highly reliable process
coupled with innovative circuit design techniques, yields
access times as fast as 12 ns with low power consumption.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs,
CE
and
OE.
The active LOW
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
The IS61WV12816BLL and IS64WV12816BLL are packaged
in the JEDEC standard 44-pin TSOP (Type II) and 48-pin
mini BGA (6mm x 8mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
128Kx16
MEMORY ARRAY
VDD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
I/O
DATA
CIRCUIT
COLUMN I/O
CE
OE
WE
UB
LB
CONTROL
CIRCUIT
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
02/03/06
1

IS64WV12816BLL-15BA3 Related Products

IS64WV12816BLL-15BA3 IS61WV12816BLL-12TI
Description Standard SRAM, 128KX16, 15ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 128KX16 STANDARD SRAM, 12ns, PDSO44, PLASTIC, TSOP2-44
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code BGA TSOP2
package instruction TFBGA, BGA48,6X8,30 PLASTIC, TSOP2-44
Contacts 48 44
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A
Maximum access time 15 ns 12 ns
I/O type COMMON COMMON
JESD-30 code R-PBGA-B48 R-PDSO-G44
JESD-609 code e0 e0
length 8 mm 18.415 mm
memory density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 16 16
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 48 44
word count 131072 words 131072 words
character code 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 128KX16 128KX16
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TSOP2
Encapsulate equivalent code BGA48,6X8,30 TSOP44,.46,32
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm
Maximum standby current 0.006 A 0.0009 A
Minimum standby current 2.5 V 3 V
Maximum slew rate 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 3.6 V 3.63 V
Minimum supply voltage (Vsup) 2.5 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING
Terminal pitch 0.75 mm 0.8 mm
Terminal location BOTTOM DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 6 mm 10.16 mm

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