AX2000-3FG1152 datasheet, PDF - EEWORLD Datasheet

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AX2000-3FG1152: DescriptionField Programmable Gate Array, 1060000 Gates, CMOS, PBGA1152, 1 MM PITCH, FBGA-1152; CategoryProgrammable logic devices Programmable logic; File Size2MB，226 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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AX2000-3FG1152 Overview

Field Programmable Gate Array, 1060000 Gates, CMOS, PBGA1152, 1 MM PITCH, FBGA-1152

AX2000-3FG1152 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1822049317
package instruction	1 MM PITCH, FBGA-1152
Reach Compliance Code	unknown
Other features	2000000 SYSTEM GATES AVAILABLE
JESD-30 code	S-PBGA-B1152
length	35 mm
Humidity sensitivity level	3
Equivalent number of gates	1060000
Number of terminals	1152
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1060000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	2.44 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	35 mm

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v2.2

Axcelerator Family FPGAs

u e

™

Leading-Edge Performance

•

350+ MHz System Performance

500+ MHz Internal Performance

High-Performance Embedded FIFOs

700 Mb/s LVDS Capable I/Os

Up to 2 Million Equivalent System Gates

Up to 684 I/Os

Up to 10,752 Dedicated Flip-Flops

Up to 295 kbits Embedded SRAM/FIFO

Manufactured on Advanced 0.15

µm

CMOS Antifuse

Process Technology, 7 Layers of Metal

Single-Chip, Nonvolatile Solution

Up to 100% Resource Utilization with 100% Pin Locking

1.5V Core Voltage for Low Power

Footprint Compatible Packaging

Flexible, Multi-Standard I/Os:

– 1.5V, 1.8V, 2.5V, 3.3V Mixed Voltage Operation

– Bank-Selectable I/Os – 8 Banks per Chip

– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V

PCI, and 3.3V PCI-X

– Differential I/O Standards: LVPECL and LVDS

AX125

125,000

82,000

672

1,344

18,432

168

504

180

Specifications

•

Features

•

Voltage-Referenced I/O Standards: GTL+, HSTL

Class 1, SSTL2 Class 1 and 2, SSTL3 Class 1 and 2

– Registered I/Os

– Hot-Swap Compliant I/Os (except PCI)

– Programmable Slew Rate and Drive Strength on

Outputs

– Programmable Delay and Weak Pull-Up/Pull-Down

Circuits on Inputs

Embedded Memory:

– Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4,

x9, x18, x36 Organizations Available)

– Independent, Width-Configurable Read and Write Ports

– Programmable Embedded FIFO Control Logic

Segmentable Clock Resources

Embedded Phase-Locked Loop:

– 14-200 MHz Input Range

– Frequency Synthesis Capabilities up to 1 GHz

Deterministic, User-Controllable Timing

Unique In-System Diagnostic and Debug Capability

with Actel Silicon Explorer II

Boundary-Scan Testing Compliant with IEEE Standard

1149.1 (JTAG)

FuseLock

Secure Programming Technology

Prevents Reverse Engineering and Design Theft

–

Table 1 •

Axcelerator Family Product Profile

Device

Capacity (in Equivalent System Gates)

Typical Gates

Modules

Combinatorial (C-cells)

Maximum Flip-Flops

Embedded RAM/FIFO

Number of Core RAM Blocks

Total Bits of Core RAM

Clocks (Segmentable)

Hardwired

Routed

PLLs

I/Os

I/O Banks

Maximum User I/Os

Maximum LVDS Channels

Total I/O Registers

Package

CSP

PQFP

BGA

FBGA

CQFP

CCGA

AX250

250,000

154,000

1,408

2,816

55,296

248

124

744

AX500

500,000

286,000

2,688

5,376

73,728

336

168

1,008

AX1000

1,000,000

612,000

6,048

12,096

165,888

516

258

1,548

AX2000

2,000,000

1,060,000

10,752

21,504

294,912

684

342

2,052

208

256, 324

256, 484

208, 352

208

484, 676

208, 352

729

484, 676, 896

352

624

896, 1152

352

624

September 2004

*See Actel’s website for the latest version of the datasheet.

Axcelerator Family FPGAs

Table of Contents

General Description

Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Programmable Interconnect Element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Logic Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

I/O Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

Routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

Low Power (LP) Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

Design Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

In-System Diagnostic and Debug Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

Detailed Specifications

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

Voltage-Referenced I/O Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32

Differential Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-39

Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-43

Routing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50

Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-55

Axcelerator Clock Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-63

Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-72

Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-90

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-92

Package Pin Assignments

180-Pin CSP

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

729-Pin PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

324-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

676-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36

896-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-49

v2.2

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