W78E52P-16 datasheet, PDF - EEWORLD Datasheet

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W78E52P-16: DescriptionMicrocontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44; CategoryThe embedded processor and controller Microcontrollers and processors; File Size484KB，19 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W78E52P-16 Overview

Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44

W78E52P-16 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	LCC
package instruction	PLASTIC, LCC-44
Contacts	44
Reach Compliance Code	not_compliant
ECCN code	3A991.A.2
Has ADC	NO
Address bus width	16
bit size	8
CPU series	8051
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQCC-J44
JESD-609 code	e0
length	16.59 mm
Number of I/O lines	32
Number of terminals	44
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	8192
ROM programmability	FLASH
Maximum seat height	4.699 mm
speed	8 MHz
Maximum slew rate	50 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.59 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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W78E52P-16 Related Products

	W78E52P-16	W78E52F-40	W78E52P-24	W78E52F-24	W78E52-24	W78E52M-40	W78E52-16	W78E52-40
Description	Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44	Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44	Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PDIP40, DIP-40	Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, TQFP-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40	Microcontroller, 8-Bit, FLASH, 8051 CPU, 20MHz, CMOS, PDIP40, DIP-40
Parts packaging code	LCC	QFP	LCC	QFP	DIP	QFP	DIP	DIP
package instruction	PLASTIC, LCC-44	QFP,	PLASTIC, LCC-44	QFP,	DIP-40	TQFP,	DIP-40	DIP-40
Contacts	44	44	44	44	40	44	40	40
Reach Compliance Code	not_compliant	unknown	not_compliant	unknown	not_compliant	unknown	_compli	_compli
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	NO	NO	NO	NO	NO	NO	NO	NO
Address bus width	16	16	16	16	16	16	16	16
bit size	8	8	8	8	8	8	8	8
maximum clock frequency	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8	8	8
JESD-30 code	S-PQCC-J44	S-PQFP-G44	S-PQCC-J44	S-PQFP-G44	R-PDIP-T40	S-PQFP-G44	R-PDIP-T40	R-PDIP-T40
length	16.59 mm	10 mm	16.59 mm	10 mm	52.2 mm	10 mm	52.2 mm	52.2 mm
Number of I/O lines	32	32	32	32	32	32	32	32
Number of terminals	44	44	44	44	40	44	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QFP	QCCJ	QFP	DIP	TQFP	DIP	DIP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	FLATPACK, THIN PROFILE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	4.699 mm	2.7 mm	4.699 mm	2.7 mm	5.334 mm	1.2 mm	5.334 mm	5.334 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	GULL WING	J BEND	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	0.8 mm	1.27 mm	0.8 mm	2.54 mm	0.8 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	DUAL	QUAD	DUAL	DUAL
width	16.59 mm	10 mm	16.59 mm	10 mm	15.24 mm	10 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Is it Rohs certified?	incompatible	-	incompatible	-	incompatible	-	incompatible	incompatible
Maker	Winbond Electronics Corporation	-	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
CPU series	8051	-	8051	-	8051	-	8051	8051
JESD-609 code	e0	-	e0	-	e0	-	e0	e0
Encapsulate equivalent code	LDCC44,.7SQ	-	LDCC44,.7SQ	-	DIP40,.6	-	DIP40,.6	DIP40,.6
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	-	5 V	-	5 V	-	5 V	5 V
RAM (bytes)	256	-	256	-	256	-	256	256
rom(word)	8192	-	8192	-	8192	-	8192	8192
speed	8 MHz	-	12 MHz	-	12 MHz	-	8 MHz	20 MHz
Maximum slew rate	50 mA	-	50 mA	-	50 mA	-	50 mA	50 mA
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED

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