Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Winbond Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP-40 |
| Contacts | 40 |
| Reach Compliance Code | _compli |
| ECCN code | 3A991.A.2 |
| Has ADC | NO |
| Address bus width | 16 |
| bit size | 8 |
| CPU series | 8051 |
| maximum clock frequency | 40 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| length | 52.2 mm |
| Number of I/O lines | 32 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 8192 |
| ROM programmability | FLASH |
| Maximum seat height | 5.334 mm |
| speed | 8 MHz |
| Maximum slew rate | 50 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| W78E52-16 | W78E52F-40 | W78E52P-24 | W78E52F-24 | W78E52P-16 | W78E52-24 | W78E52M-40 | W78E52-40 | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40 | Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PDIP40, DIP-40 | Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, TQFP-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 20MHz, CMOS, PDIP40, DIP-40 |
| Parts packaging code | DIP | QFP | LCC | QFP | LCC | DIP | QFP | DIP |
| package instruction | DIP-40 | QFP, | PLASTIC, LCC-44 | QFP, | PLASTIC, LCC-44 | DIP-40 | TQFP, | DIP-40 |
| Contacts | 40 | 44 | 44 | 44 | 44 | 40 | 44 | 40 |
| Reach Compliance Code | _compli | unknown | not_compliant | unknown | not_compliant | not_compliant | unknown | _compli |
| ECCN code | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| Has ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-PDIP-T40 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T40 |
| length | 52.2 mm | 10 mm | 16.59 mm | 10 mm | 16.59 mm | 52.2 mm | 10 mm | 52.2 mm |
| Number of I/O lines | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of terminals | 40 | 44 | 44 | 44 | 44 | 40 | 44 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM channel | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP | QCCJ | QFP | QCCJ | DIP | TQFP | DIP |
| Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK, THIN PROFILE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| Maximum seat height | 5.334 mm | 2.7 mm | 4.699 mm | 2.7 mm | 4.699 mm | 5.334 mm | 1.2 mm | 5.334 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | GULL WING | J BEND | GULL WING | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm | 2.54 mm | 0.8 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL |
| width | 15.24 mm | 10 mm | 16.59 mm | 10 mm | 16.59 mm | 15.24 mm | 10 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Is it Rohs certified? | incompatible | - | incompatible | - | incompatible | incompatible | - | incompatible |
| Maker | Winbond Electronics Corporation | - | - | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation |
| CPU series | 8051 | - | 8051 | - | 8051 | 8051 | - | 8051 |
| JESD-609 code | e0 | - | e0 | - | e0 | e0 | - | e0 |
| Encapsulate equivalent code | DIP40,.6 | - | LDCC44,.7SQ | - | LDCC44,.7SQ | DIP40,.6 | - | DIP40,.6 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| power supply | 5 V | - | 5 V | - | 5 V | 5 V | - | 5 V |
| RAM (bytes) | 256 | - | 256 | - | 256 | 256 | - | 256 |
| rom(word) | 8192 | - | 8192 | - | 8192 | 8192 | - | 8192 |
| speed | 8 MHz | - | 12 MHz | - | 8 MHz | 12 MHz | - | 20 MHz |
| Maximum slew rate | 50 mA | - | 50 mA | - | 50 mA | 50 mA | - | 50 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |