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W78E52-16

Description
Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size484KB,19 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W78E52-16 Overview

Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40

W78E52-16 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeDIP
package instructionDIP-40
Contacts40
Reach Compliance Code_compli
ECCN code3A991.A.2
Has ADCNO
Address bus width16
bit size8
CPU series8051
maximum clock frequency40 MHz
DAC channelNO
DMA channelNO
External data bus width8
JESD-30 codeR-PDIP-T40
JESD-609 codee0
length52.2 mm
Number of I/O lines32
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)8192
ROM programmabilityFLASH
Maximum seat height5.334 mm
speed8 MHz
Maximum slew rate50 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

W78E52-16 Related Products

W78E52-16 W78E52F-40 W78E52P-24 W78E52F-24 W78E52P-16 W78E52-24 W78E52M-40 W78E52-40
Description Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40 Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44 Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44 Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44 Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44 Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PDIP40, DIP-40 Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, TQFP-44 Microcontroller, 8-Bit, FLASH, 8051 CPU, 20MHz, CMOS, PDIP40, DIP-40
Parts packaging code DIP QFP LCC QFP LCC DIP QFP DIP
package instruction DIP-40 QFP, PLASTIC, LCC-44 QFP, PLASTIC, LCC-44 DIP-40 TQFP, DIP-40
Contacts 40 44 44 44 44 40 44 40
Reach Compliance Code _compli unknown not_compliant unknown not_compliant not_compliant unknown _compli
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2
Has ADC NO NO NO NO NO NO NO NO
Address bus width 16 16 16 16 16 16 16 16
bit size 8 8 8 8 8 8 8 8
maximum clock frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
DAC channel NO NO NO NO NO NO NO NO
DMA channel NO NO NO NO NO NO NO NO
External data bus width 8 8 8 8 8 8 8 8
JESD-30 code R-PDIP-T40 S-PQFP-G44 S-PQCC-J44 S-PQFP-G44 S-PQCC-J44 R-PDIP-T40 S-PQFP-G44 R-PDIP-T40
length 52.2 mm 10 mm 16.59 mm 10 mm 16.59 mm 52.2 mm 10 mm 52.2 mm
Number of I/O lines 32 32 32 32 32 32 32 32
Number of terminals 40 44 44 44 44 40 44 40
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
PWM channel NO NO NO NO NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QFP QCCJ QFP QCCJ DIP TQFP DIP
Package shape RECTANGULAR SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE FLATPACK CHIP CARRIER FLATPACK CHIP CARRIER IN-LINE FLATPACK, THIN PROFILE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 5.334 mm 2.7 mm 4.699 mm 2.7 mm 4.699 mm 5.334 mm 1.2 mm 5.334 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE GULL WING J BEND GULL WING J BEND THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 0.8 mm 1.27 mm 0.8 mm 1.27 mm 2.54 mm 0.8 mm 2.54 mm
Terminal location DUAL QUAD QUAD QUAD QUAD DUAL QUAD DUAL
width 15.24 mm 10 mm 16.59 mm 10 mm 16.59 mm 15.24 mm 10 mm 15.24 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Is it Rohs certified? incompatible - incompatible - incompatible incompatible - incompatible
Maker Winbond Electronics Corporation - - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
CPU series 8051 - 8051 - 8051 8051 - 8051
JESD-609 code e0 - e0 - e0 e0 - e0
Encapsulate equivalent code DIP40,.6 - LDCC44,.7SQ - LDCC44,.7SQ DIP40,.6 - DIP40,.6
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
power supply 5 V - 5 V - 5 V 5 V - 5 V
RAM (bytes) 256 - 256 - 256 256 - 256
rom(word) 8192 - 8192 - 8192 8192 - 8192
speed 8 MHz - 12 MHz - 8 MHz 12 MHz - 20 MHz
Maximum slew rate 50 mA - 50 mA - 50 mA 50 mA - 50 mA
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
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