W78E52F-24 datasheet, PDF - EEWORLD Datasheet

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W78E52F-24: DescriptionMicrocontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44; CategoryThe embedded processor and controller Microcontrollers and processors; File Size484KB，19 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W78E52F-24 Overview

Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44

W78E52F-24 Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Parts packaging code	QFP
package instruction	QFP,
Contacts	44
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Has ADC	NO
Address bus width	16
bit size	8
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQFP-G44
length	10 mm
Number of I/O lines	32
Number of terminals	44
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	2.7 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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W78E52F-24 Related Products

	W78E52F-24	W78E52F-40	W78E52P-24	W78E52P-16	W78E52-24	W78E52M-40	W78E52-16	W78E52-40
Description	Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44	Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PDIP40, DIP-40	Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, TQFP-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40	Microcontroller, 8-Bit, FLASH, 8051 CPU, 20MHz, CMOS, PDIP40, DIP-40
Parts packaging code	QFP	QFP	LCC	LCC	DIP	QFP	DIP	DIP
package instruction	QFP,	QFP,	PLASTIC, LCC-44	PLASTIC, LCC-44	DIP-40	TQFP,	DIP-40	DIP-40
Contacts	44	44	44	44	40	44	40	40
Reach Compliance Code	unknown	unknown	not_compliant	not_compliant	not_compliant	unknown	_compli	_compli
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	NO	NO	NO	NO	NO	NO	NO	NO
Address bus width	16	16	16	16	16	16	16	16
bit size	8	8	8	8	8	8	8	8
maximum clock frequency	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8	8	8
JESD-30 code	S-PQFP-G44	S-PQFP-G44	S-PQCC-J44	S-PQCC-J44	R-PDIP-T40	S-PQFP-G44	R-PDIP-T40	R-PDIP-T40
length	10 mm	10 mm	16.59 mm	16.59 mm	52.2 mm	10 mm	52.2 mm	52.2 mm
Number of I/O lines	32	32	32	32	32	32	32	32
Number of terminals	44	44	44	44	40	44	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QCCJ	QCCJ	DIP	TQFP	DIP	DIP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	CHIP CARRIER	CHIP CARRIER	IN-LINE	FLATPACK, THIN PROFILE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	2.7 mm	2.7 mm	4.699 mm	4.699 mm	5.334 mm	1.2 mm	5.334 mm	5.334 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	J BEND	J BEND	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	0.8 mm	0.8 mm	1.27 mm	1.27 mm	2.54 mm	0.8 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	DUAL	QUAD	DUAL	DUAL
width	10 mm	10 mm	16.59 mm	16.59 mm	15.24 mm	10 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	Winbond Electronics Corporation	-	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Is it Rohs certified?	-	-	incompatible	incompatible	incompatible	-	incompatible	incompatible
CPU series	-	-	8051	8051	8051	-	8051	8051
JESD-609 code	-	-	e0	e0	e0	-	e0	e0
Encapsulate equivalent code	-	-	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	-	DIP40,.6	DIP40,.6
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	-	-	5 V	5 V	5 V	-	5 V	5 V
RAM (bytes)	-	-	256	256	256	-	256	256
rom(word)	-	-	8192	8192	8192	-	8192	8192
speed	-	-	12 MHz	8 MHz	12 MHz	-	8 MHz	20 MHz
Maximum slew rate	-	-	50 mA	50 mA	50 mA	-	50 mA	50 mA
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED

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