WS57C64F-70CMB datasheet, PDF - EEWORLD Datasheet

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WS57C64F-70CMB: DescriptionUVPROM, 8KX8, 70ns, CMOS, CQCC32,; Categorystorage storage; File Size140KB，5 Pages; ManufacturerWaferscale Integration Inc.

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WS57C64F-70CMB Overview

UVPROM, 8KX8, 70ns, CMOS, CQCC32,

WS57C64F-70CMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Waferscale Integration Inc.
Reach Compliance Code	unknown
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	13.5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.0005 A
Maximum slew rate	0.092 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

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WS57C64F-70CMB Related Products

	WS57C64F-70CMB	WS57C64F-70J	WS57C64F-55D	WS57C64F-55J	WS57C64F-70DI	WS57C64F-70D	WS57C64F-70DMB
Description	UVPROM, 8KX8, 70ns, CMOS, CQCC32,	OTP ROM, 8KX8, 70ns, CMOS, PQCC32,	UVPROM, 8KX8, 55ns, CMOS, CDIP28,	OTP ROM, 8KX8, 55ns, CMOS, PQCC32,	UVPROM, 8KX8, 70ns, CMOS, CDIP28,	UVPROM, 8KX8, 70ns, CMOS, CDIP28,	UVPROM, 8KX8, 70ns, CMOS, CDIP28,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Maximum access time	70 ns	70 ns	55 ns	55 ns	70 ns	70 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-CQCC-N32	R-PQCC-J32	R-GDIP-T28	R-PQCC-J32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	UVPROM	OTP ROM	UVPROM	OTP ROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	28	32	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	85 °C	70 °C	125 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	QCCJ	DIP	QCCJ	DIP	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	LDCC32,.5X.6	DIP28,.6	LDCC32,.5X.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A
Maximum slew rate	0.092 mA	0.082 mA	0.098 mA	0.025 mA	0.092 mA	0.082 mA	0.092 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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