WS57C64F-55D datasheet, PDF - EEWORLD Datasheet

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WS57C64F-55D: DescriptionUVPROM, 8KX8, 55ns, CMOS, CDIP28,; Categorystorage storage; File Size140KB，5 Pages; ManufacturerWaferscale Integration Inc.

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WS57C64F-55D Overview

UVPROM, 8KX8, 55ns, CMOS, CDIP28,

WS57C64F-55D Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Waferscale Integration Inc.
Reach Compliance Code	unknown
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	13.5 V
Certification status	Not Qualified
Maximum standby current	0.0005 A
Maximum slew rate	0.098 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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WS57C64F-55D Related Products

	WS57C64F-55D	WS57C64F-70CMB	WS57C64F-70J	WS57C64F-55J	WS57C64F-70DI	WS57C64F-70D	WS57C64F-70DMB
Description	UVPROM, 8KX8, 55ns, CMOS, CDIP28,	UVPROM, 8KX8, 70ns, CMOS, CQCC32,	OTP ROM, 8KX8, 70ns, CMOS, PQCC32,	OTP ROM, 8KX8, 55ns, CMOS, PQCC32,	UVPROM, 8KX8, 70ns, CMOS, CDIP28,	UVPROM, 8KX8, 70ns, CMOS, CDIP28,	UVPROM, 8KX8, 70ns, CMOS, CDIP28,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Maximum access time	55 ns	70 ns	70 ns	55 ns	70 ns	70 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-GDIP-T28	R-CQCC-N32	R-PQCC-J32	R-PQCC-J32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	UVPROM	UVPROM	OTP ROM	OTP ROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	32	32	32	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	85 °C	70 °C	125 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCN	QCCJ	QCCJ	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	LCC32,.45X.55	LDCC32,.5X.6	LDCC32,.5X.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V	13.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A
Maximum slew rate	0.098 mA	0.092 mA	0.082 mA	0.025 mA	0.092 mA	0.082 mA	0.092 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	NO LEAD	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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