AM29C941DC datasheet, PDF - EEWORLD Datasheet

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AM29C941DC: DescriptionD Latch, 1-Func, 10-Bit, CMOS, CDIP24; Categorylogic logic; File Size492KB，10 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29C941DC Overview

D Latch, 1-Func, 10-Bit, CMOS, CDIP24

AM29C941DC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknow
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.024 A
Number of digits	10
Number of functions	1
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Prop。Delay @ Nom-Su	13 ns
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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Description	D Latch, 1-Func, 10-Bit, CMOS, CDIP24	D Latch, 1-Func, 10-Bit, CMOS, CDIP24	D Latch, 1-Func, 10-Bit, CMOS, PDIP24	D Latch, 1-Func, 9-Bit, CMOS, CDIP24	D Latch, 1-Func, 9-Bit, CMOS, PDIP24	D Latch, 1-Func, 9-Bit, CMOS, PDIP24	D Latch, 1-Func, 9-Bit, CMOS, CDIP24	D Latch, 1-Func, 10-Bit, CMOS, PDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24	R-PDIP-T24	R-PDIP-T24	R-XDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
Number of digits	10	10	10	9	9	9	9	10
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Prop。Delay @ Nom-Su	13 ns	11 ns	11 ns	13 ns	13 ns	13 ns	13 ns	13 ns
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1

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