SN74LS716JD datasheet, PDF - EEWORLD Datasheet

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SN74LS716JD: DescriptionIC,COUNTER,DOWN,DECADE,LS-TTL,DIP,16PIN,CERAMIC; Categorylogic logic; File Size213KB，6 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SN74LS716JD Overview

IC,COUNTER,DOWN,DECADE,LS-TTL,DIP,16PIN,CERAMIC

SN74LS716JD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Counting direction	DOWN
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load/preset input	YES
Logic integrated circuit type	DECADE COUNTER
Operating mode	ASYNCHRONOUS
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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SN74LS716JD Related Products

	SN74LS716JD	54LS716/B2AJC	SN74LS716NS	SN74LS716NDS	741X043121FP
Description	IC,COUNTER,DOWN,DECADE,LS-TTL,DIP,16PIN,CERAMIC	IC,COUNTER,DOWN,DECADE,LS-TTL,LLCC,20PIN,CERAMIC	IC,COUNTER,DOWN,DECADE,LS-TTL,DIP,16PIN,PLASTIC	IC,COUNTER,DOWN,DECADE,LS-TTL,DIP,16PIN,PLASTIC	Chip Resistor Arrays
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-
Maker	NXP	NXP	-	NXP	-
package instruction	DIP, DIP16,.3	QCCN, LCC20,.35SQ	DIP, DIP16,.3	DIP, DIP16,.3	-
Reach Compliance Code	unknown	unknown	unknown	unknown	-
Counting direction	DOWN	DOWN	DOWN	DOWN	-
JESD-30 code	R-XDIP-T16	S-XQCC-N20	R-PDIP-T16	R-PDIP-T16	-
JESD-609 code	e0	e0	e0	e0	-
Load/preset input	YES	YES	YES	YES	-
Logic integrated circuit type	DECADE COUNTER	DECADE COUNTER	DECADE COUNTER	DECADE COUNTER	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Number of functions	1	1	1	1	-
Number of terminals	16	20	16	16	-
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	-
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	DIP	QCCN	DIP	DIP	-
Encapsulate equivalent code	DIP16,.3	LCC20,.35SQ	DIP16,.3	DIP16,.3	-
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	-
power supply	5 V	5 V	5 V	5 V	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	-
surface mount	NO	YES	NO	NO	-
technology	TTL	TTL	TTL	TTL	-
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	-
Terminal location	DUAL	QUAD	DUAL	DUAL	-

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