|
74LVC38APY |
74LVC38ADC |
74LVC38APG |
| Description |
NAND Gate, CMOS, PDSO14 |
NAND Gate, CMOS, PDSO14 |
NAND Gate, CMOS, PDSO14 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Reach Compliance Code |
unknown |
unknown |
not_compliant |
| JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
| MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
| Number of terminals |
14 |
14 |
14 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SSOP |
SOP |
TSSOP |
| Encapsulate equivalent code |
SSOP14,.3 |
SOP14,.25 |
TSSOP14,.25 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| power supply |
3.3 V |
3.3 V |
3.3 V |
| Prop。Delay @ Nom-Sup |
5.2 ns |
5.2 ns |
5.2 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Schmitt trigger |
NO |
NO |
NO |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.635 mm |
1.27 mm |
0.635 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| package instruction |
SSOP, SSOP14,.3 |
SOP, SOP14,.25 |
- |