M25P23-VMF6TP datasheet, PDF - EEWORLD Datasheet

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M25P23-VMF6TP: Description4M X 8 FLASH 2.7V PROM, PDSO16; Categorystorage; File Size612KB，50 Pages; ManufacturerMicron; Websitehttp://www.micron.com/

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M25P23-VMF6TP Overview

4M X 8 FLASH 2.7V PROM, PDSO16

M25P23-VMF6TP Parametric

Parameter Name	Attribute value
maximum clock frequency	75 MHz
Number of functions	1
Number of terminals	16
Minimum operating temperature	-40 Cel
Maximum operating temperature	125 Cel
Minimum supply/operating voltage	2.7 V
Maximum supply/operating voltage	3.6 V
Processing package description	0.300 INCH, ROHS COMPLIANT, SOP-16
each_compli	Yes
EU RoHS regulations	Yes
state	Active
ype	NOR TYPE
sub_category	Flash Memories
data_retention_time_mi	20
endurance	100000 Write/Erase Cycles
jesd_30_code	R-PDSO-G16
storage density	3.36E7 bit
Memory IC type	FLASH
memory width	8
moisture_sensitivity_level	NOT SPECIFIED
Number of digits	4.19E6 words
Number of digits	4M
operating mode	SYNCHRONOUS
organize	4MX8
Packaging Materials	PLASTIC/EPOXY
ckage_code	SOP
ckage_equivalence_code	SOP16,.4
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE
serial parallel	SERIAL
eak_reflow_temperature__cel_	NOT SPECIFIED
wer_supplies__v_	3/3.3
gramming_voltage__v_	2.7
qualification_status	COMMERCIAL
seated_height_max	2.65 mm
serial_bus_type	SPI
standby_current_max	5.00E-5 Amp
Maximum supply voltage	0.0200 Amp
surface mount	YES
Craftsmanship	CMOS
Temperature level	AUTOMOTIVE
terminal coating	NOT SPECIFIED
Terminal form	GULL WING
Terminal spacing	1.27 mm
Terminal location	DUAL
ime_peak_reflow_temperature_max__s_	NOT SPECIFIED
write_protecti	HARDWARE/SOFTWARE
length	10.3 mm
width	7.5 mm

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Micron M25P32 Serial Flash Embedded Memory

Features

Micron M25P32 Serial Flash Embedded

Memory

M25P32-VMF3TPB, -VMF6PBA, -VMF6TP

M25P32-VMW3TGB, VMW6GBA

Features

•

SPI bus compatible serial interface

32Mb Flash memory

75 MHz clock frequency (maximum)

2.7V to 3.6V single supply voltage

= 9V for FAST PROGRAM/ERASE mode (option-

al)

Page program (up to 256 bytes) in 0.64ms (TYP)

Erase capability

– Sector erase: 512Kb in 0.6 s (TYP)

– Bulk erase: 23 s (TYP); 17 s (TYP) with V

= 9V

Write protection

– Hardware write protection: protected area size

defined by non-volatile bits BP0, BP1, BP2

Deep power down: 1µA (TYP)

• Electronic signature

– JEDEC standard 2-byte signature (2016h)

– Unique ID code (UID) and 16 bytes of common

flash interface (CFI) data

– RES command, one-byte signature (15h) for

backward compatibility

• More than 100,000 write cycles per sector

• More than 20 years data retention

• Automotive grade parts available

• Packages (RoHS compliant)

– SO8W (MW) 208 mils

– SO16 (MF) 300 mils

– VFQFPN8 (MP) MLP8 6mm x 5mm

– VFDFPN8 (MP) MLP8 8mm x 6mm

PDF: 09005aef84566541

m25p32.pdf - Rev. M 9/11 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Micron M25P32 Serial Flash Embedded Memory

Features

Contents

Functional Description ..................................................................................................................................... 6

Signal Descriptions ........................................................................................................................................... 8

SPI Modes ........................................................................................................................................................ 9

Operating Features ......................................................................................................................................... 11

Page Programming ..................................................................................................................................... 11

Sector Erase, Bulk Erase .............................................................................................................................. 11

Polling during a Write, Program, or Erase Cycle ............................................................................................ 11

Active Power, Standby Power, and Deep Power-Down .................................................................................. 11

Status Register ............................................................................................................................................ 12

Data Protection by Protocol ........................................................................................................................ 12

Software Data Protection ............................................................................................................................ 12

Hardware Data Protection .......................................................................................................................... 12

Hold Condition .......................................................................................................................................... 13

Configuration and Memory Map ..................................................................................................................... 14

Memory Configuration and Block Diagram .................................................................................................. 14

Memory Map – 32Mb Density ......................................................................................................................... 15

Command Set Overview ................................................................................................................................. 16

WRITE ENABLE .............................................................................................................................................. 18

WRITE DISABLE ............................................................................................................................................. 19

READ IDENTIFICATION ................................................................................................................................. 20

READ STATUS REGISTER ................................................................................................................................ 21

WIP Bit ...................................................................................................................................................... 21

WEL Bit ...................................................................................................................................................... 21

BP2, BP1, BP0 Bits ...................................................................................................................................... 22

SRWD Bit ................................................................................................................................................... 22

WRITE STATUS REGISTER .............................................................................................................................. 23

READ DATA BYTES ......................................................................................................................................... 25

READ DATA BYTES at HIGHER SPEED ............................................................................................................ 26

PAGE PROGRAM ............................................................................................................................................ 27

SECTOR ERASE .............................................................................................................................................. 28

BULK ERASE .................................................................................................................................................. 29

DEEP POWER-DOWN ..................................................................................................................................... 30

RELEASE from DEEP POWER-DOWN .............................................................................................................. 31

READ ELECTRONIC SIGNATURE .................................................................................................................... 32

Power-Up/Down and Supply Line Decoupling ................................................................................................. 33

Power-Up Timing and Write Inhibit Voltage Threshold Specifications ............................................................... 35

Maximum Ratings and Operating Conditions .................................................................................................. 36

Electrical Characteristics ................................................................................................................................ 37

AC Characteristics .......................................................................................................................................... 38

Package Information ...................................................................................................................................... 43

Device Ordering Information .......................................................................................................................... 47

Standard Parts ............................................................................................................................................ 47

Automotive Parts ........................................................................................................................................ 47

Revision History ............................................................................................................................................. 49

Rev. M – 09/2011 ........................................................................................................................................ 49

Rev. 12.0 – 3/2010 ....................................................................................................................................... 49

Rev. 11.0 – 10/2009 ..................................................................................................................................... 49

Rev. 10.0 – 2/2009 ....................................................................................................................................... 49

Rev. 9.0 – 12/2008 ....................................................................................................................................... 49

Rev. 8.0 – 11/2008 ....................................................................................................................................... 49

PDF: 09005aef84566541

m25p32.pdf - Rev. M 9/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Micron M25P32 Serial Flash Embedded Memory

Features

List of Figures

Figure 1: Logic Diagram ................................................................................................................................... 6

Figure 2: Pin Connections: SO8, MLP8 ............................................................................................................. 7

Figure 3: Pin Connections: SO16 ...................................................................................................................... 7

Figure 4: SPI Modes Supported ........................................................................................................................ 9

Figure 5: Bus Master and Memory Devices on the SPI Bus ............................................................................... 10

Figure 6: Hold Condition Activation ............................................................................................................... 13

Figure 7: Block Diagram ................................................................................................................................ 14

Figure 8: WRITE ENABLE Command Sequence .............................................................................................. 18

Figure 9: WRITE DISABLE Command Sequence ............................................................................................. 19

Figure 10: READ IDENTIFICATION Command Sequence ................................................................................ 20

Figure 11: READ STATUS REGISTER Command Sequence .............................................................................. 21

Figure 12: Status Register Format ................................................................................................................... 21

Figure 13: WRITE STATUS REGISTER Command Sequence ............................................................................. 23

Figure 14: READ DATA BYTES Command Sequence ........................................................................................ 25

Figure 15: READ DATA BYTES at HIGHER SPEED Command Sequence ........................................................... 26

Figure 16: PAGE PROGRAM Command Sequence ........................................................................................... 27

Figure 17: SECTOR ERASE Command Sequence ............................................................................................. 28

Figure 18: BULK ERASE Command Sequence ................................................................................................. 29

Figure 19: DEEP POWER-DOWN Command Sequence ................................................................................... 30

Figure 20: RELEASE from DEEP POWER-DOWN Command Sequence ............................................................. 31

Figure 21: READ ELECTRONIC SIGNATURE Command Sequence .................................................................. 32

Figure 22: Power-Up Timing .......................................................................................................................... 34

Figure 23: AC Measurement I/O Waveform ..................................................................................................... 38

Figure 24: Serial Input Timing ........................................................................................................................ 41

Figure 25: Write Protect Setup and Hold during WRSR when SRWD=1 Timing ................................................. 41

Figure 26: Hold Timing .................................................................................................................................. 42

Figure 27: Output Timing .............................................................................................................................. 42

Figure 28: SO8W 208 mils Body Width ............................................................................................................ 43

Figure 29: SO16W 300 mils Body Width .......................................................................................................... 44

Figure 30: VFQFPN8 (MLP8) 6mm x 5mm ...................................................................................................... 45

Figure 31: VFDFPN8 (MLP8) 8mm x 6mm ...................................................................................................... 46

PDF: 09005aef84566541

m25p32.pdf - Rev. M 9/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Micron M25P32 Serial Flash Embedded Memory

Features

List of Tables

Table 1: Signal Names ...................................................................................................................................... 6

Table 2: Signal Descriptions ............................................................................................................................. 8

Table 3: Protected Area Sizes .......................................................................................................................... 12

Table 4: Sectors 63:0 ...................................................................................................................................... 15

Table 5: Command Set Codes ........................................................................................................................ 17

Table 6: READ IDENTIFICATION Data Out Sequence ..................................................................................... 20

Table 7: Status Register Protection Modes ...................................................................................................... 23

Table 8: Power-Up Timing and V

Threshold ................................................................................................. 35

Table 9: Absolute Maximum Ratings .............................................................................................................. 36

Table 10: Operating Conditions ...................................................................................................................... 36

Table 11: Data Retention and Endurance ........................................................................................................ 36

Table 12: DC Current Specifications ............................................................................................................... 37

Table 13: DC Voltage Specifications ................................................................................................................ 37

Table 14: AC Measurement Conditions ........................................................................................................... 38

Table 15: Capacitance .................................................................................................................................... 38

Table 16: AC Specifications (75MHz, Device Grade 3 and 6, V

[min])=2.7V ..................................................... 39

Table 17: Instruction Times, Process Technology 110nm ................................................................................. 40

Table 18: Part Number Example ..................................................................................................................... 47

Table 19: Part Number Information Scheme ................................................................................................... 47

Table 20: Part Number Example ..................................................................................................................... 48

Table 21: Part Number Information Scheme ................................................................................................... 48

PDF: 09005aef84566541

m25p32.pdf - Rev. M 9/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

M25P23-VMF6TP Related Products

	M25P23-VMF6TP	M25P23-VMF6PBA	M25P23-VMW6GBA	M25P32-VMW3TGB
Description	4M X 8 FLASH 2.7V PROM, PDSO16	4M X 8 FLASH 2.7V PROM, PDSO16	4M X 8 FLASH 2.7V PROM, PDSO16	4M X 8 FLASH 2.7V PROM, PDSO8
maximum clock frequency	75 MHz	75 MHz	75 MHz	75 MHz
Number of functions	1	1	1	1
Number of terminals	16	16	16	8
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Maximum operating temperature	125 Cel	125 Cel	125 Cel	125 Cel
Minimum supply/operating voltage	2.7 V	2.7 V	2.7 V	2.7 V
Maximum supply/operating voltage	3.6 V	3.6 V	3.6 V	3.6 V
Processing package description	0.300 INCH, ROHS COMPLIANT, SOP-16	0.300 INCH, ROHS COMPLIANT, SOP-16	0.300 INCH, ROHS COMPLIANT, SOP-16	0.208 INCH, ROHS COMPLIANT, SOP-8
EU RoHS regulations	Yes	Yes	Yes	Yes
state	Active	Active	Active	ACTIVE
storage density	3.36E7 bit	3.36E7 bit	3.36E7 bit	3.36E7 deg
Memory IC type	FLASH	FLASH	FLASH	FLASH 2.7V PROM
memory width	8	8	8	8
operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	4MX8	4MX8	4MX8	4M X 8
Packaging Materials	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
packaging shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package Size	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
serial parallel	SERIAL	SERIAL	SERIAL	SERIAL
surface mount	YES	YES	YES	Yes
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
terminal coating	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal spacing	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
each_compli	Yes	Yes	Yes	-
ype	NOR TYPE	NOR TYPE	NOR TYPE	-
sub_category	Flash Memories	Flash Memories	Flash Memories	-
data_retention_time_mi	20	20	20	-
endurance	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-
jesd_30_code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	-
moisture_sensitivity_level	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Number of digits	4M	4M	4M	4M
ckage_code	SOP	SOP	SOP	-
ckage_equivalence_code	SOP16,.4	SOP16,.4	SOP16,.4	-
eak_reflow_temperature__cel_	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
wer_supplies__v_	3/3.3	3/3.3	3/3.3	-
gramming_voltage__v_	2.7	2.7	2.7	-
qualification_status	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
seated_height_max	2.65 mm	2.65 mm	2.65 mm	-
serial_bus_type	SPI	SPI	SPI	-
standby_current_max	5.00E-5 Amp	5.00E-5 Amp	5.00E-5 Amp	-
Maximum supply voltage	0.0200 Amp	0.0200 Amp	0.0200 Amp	-
Craftsmanship	CMOS	CMOS	CMOS	-
ime_peak_reflow_temperature_max__s_	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
write_protecti	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-
length	10.3 mm	10.3 mm	10.3 mm	-
width	7.5 mm	7.5 mm	7.5 mm	-

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