Signal Descriptions ........................................................................................................................................... 8
Operating Features ......................................................................................................................................... 11
Polling during a Write, Program, or Erase Cycle ............................................................................................ 11
Active Power, Standby Power, and Deep Power-Down .................................................................................. 11
Status Register ............................................................................................................................................ 12
Data Protection by Protocol ........................................................................................................................ 12
Software Data Protection ............................................................................................................................ 12
Hardware Data Protection .......................................................................................................................... 12
Hold Condition .......................................................................................................................................... 13
Configuration and Memory Map ..................................................................................................................... 14
Memory Configuration and Block Diagram .................................................................................................. 14
Memory Map – 32Mb Density ......................................................................................................................... 15
Command Set Overview ................................................................................................................................. 16
READ STATUS REGISTER ................................................................................................................................ 21
WIP Bit ...................................................................................................................................................... 21
WEL Bit ...................................................................................................................................................... 21
SRWD Bit ................................................................................................................................................... 22
WRITE STATUS REGISTER .............................................................................................................................. 23
READ DATA BYTES ......................................................................................................................................... 25
READ DATA BYTES at HIGHER SPEED ............................................................................................................ 26
PAGE PROGRAM ............................................................................................................................................ 27
DEEP POWER-DOWN ..................................................................................................................................... 30
RELEASE from DEEP POWER-DOWN .............................................................................................................. 31
AC Characteristics .......................................................................................................................................... 38
Package Information ...................................................................................................................................... 43
Device Ordering Information .......................................................................................................................... 47
Standard Parts ............................................................................................................................................ 47
Automotive Parts ........................................................................................................................................ 47
Revision History ............................................................................................................................................. 49
Rev. M – 09/2011 ........................................................................................................................................ 49
Figure 11: READ STATUS REGISTER Command Sequence .............................................................................. 21
Figure 12: Status Register Format ................................................................................................................... 21
Figure 13: WRITE STATUS REGISTER Command Sequence ............................................................................. 23
Figure 14: READ DATA BYTES Command Sequence ........................................................................................ 25
Figure 15: READ DATA BYTES at HIGHER SPEED Command Sequence ........................................................... 26
Figure 16: PAGE PROGRAM Command Sequence ........................................................................................... 27
Table 11: Data Retention and Endurance ........................................................................................................ 36
Table 12: DC Current Specifications ............................................................................................................... 37
Table 13: DC Voltage Specifications ................................................................................................................ 37
Table 14: AC Measurement Conditions ........................................................................................................... 38
[size=14px]There is no power network in the highlighted part of the inner electrical layer image. Should I set this part of the network to GND or NO Net or divide it into a power network? I don't know...
1. Is it better to have a single point grounding around the crystal oscillator, or does it not matter if there are multiple points? In the circuit I laid out, there are several capacitors of the VIDEO...
I followed the "cs8900a driver porting notes" and succeeded on 2.6.14. I copied it to 2.6.22 and it didn't compile. It always says that there is a problem with the file_operations structure definition...
[i=s]This post was last edited by dontium on 2015-1-23 11:11[/i] [align=left][size=5] [font=宋体]Chapter 3 uses a simplest op amp circuit to vividly introduce the calculation of op amp noise, so that yo...
ICT Testing SMT The high assembly density of SMT has put traditional testing methods in a dilemma. Conducting testability design at the circuit and SMB (Surface Mount Board) design stage is a method c...
[i=s]This post was last edited by zca123 on 2014-1-13 20:24[/i] {:soso__3669389859068460655_3:} [flash=800,560]http://www.tudou.com/l/mCqz6JL1Rck/&rpid=54789188&resourceId=54789188_04_05_99&iid=183172...
1. Overview
Will passive devices
produce nonlinear intermodulation distortion? The answer is yes! Although there is no systematic theoretical analysis, it has been found in engineerin...[Details]
1 Introduction
The high temperature tester is mainly used for temperature tracking measurement and data acquisition during the heating process. By systematically analyzing the test data, the...[Details]
introduction
In the discharge process of tokamak plasma physics, the study of rupture and sawtooth is of great significance. Rupture and sawtooth exist in most tokamaks. Rupture is a notew...[Details]
introduction
For the voltage regulator modules (VRMs) that power the latest computer central processing units (CPUs), power supply designers have historically used multiphase interleaved b...[Details]
With the rapid development of urban economy, elevators are increasingly used as a vertical transportation tool. However, elevator fault detection and maintenance, especially the role of elevator remot...[Details]
On the afternoon of July 10, Beijing time, Taiwan's largest chip designer MediaTek expects its smartphone chip shipments to grow by double digits in the third quarter of this year, and the company is ...[Details]
LED is the abbreviation of light emitting diode, which is an electric light source made of semiconductor technology. The core part of LED is a chip composed of P-type semiconductor and N-type semi...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
It is well known to automotive suppliers that automakers are demanding more from their supply base. For connector suppliers, this means stricter requirements for product performance, stability and ...[Details]
hint:
The number of speakers and their spacing limit the sound field of a portable stereo system.
Spatial audio attempts to artificially recreate the experience of listening to sounds i...[Details]
The era of mobile access to the Internet has arrived, and it will rapidly change the business and infrastructure needs of mobile operators under a whole new trend of requirements. We need 4G LTE to...[Details]
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1 Basic Features
In computer control systems and various intelligent instruments and meters composed of single-chip microcomputers (or microprocessors), various external analog signals must be ...[Details]
1 Introduction to the overall system solution
The hardware part is mainly used to amplify the sound. When the sound is loud enough, the signal can be introduced into the microcontroller for de...[Details]
1 Introduction
At present, advocating health has become the focus of people's attention, and the emergence of treadmills has become more and more popular. People can exercise at home or in the ...[Details]
PCB Design
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