FEATURES
Glass Passivated Junction Fast Switching Rectifiers
Reverse Voltage 50 to 1000V Forward Current
3.0A
RGP30A thru RGP30MA
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High temperature metallurgically bonded construction
* Glass passivated chip
* Capable of meeting environmental standards of MIL-S-19500
*
3.0
A operation at TA=55°C with no thermal runaway
* For use in high frequency rectifier circuits
* Fast switching for high efficiency
* Typical IR less than 0.1µA
* High temperature soldering guaranteed:
350°C/10 seconds
* 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case:
JEDEC DO-201AD, molded plastic over glass die
Terminals:
Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.038 oz.,
1.03g
Handling precautin:None
We declare that the material of product compliance
with ROHS requirements
1.Electrical Characteristic
Maximum & Thermal Characteristics Ratings
at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
device marking code
Maximum repetitive peak reverse voltage
Maximum RSM voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
= 55°C
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC Method)
Maximum full load reverse current, full cycle
average,0.375"(9.5mm) lead lengths at T
A
= 55°C
Typical thermal resistance (Note 2)
Operating junction and storage temperature range
V
RRM
V
RSM
V
DC
IF(AV)
I
FSM
IR(AV)
RθJA
TJ, TSTG
RGP
30A
RGP
30B
RGP
30D
symbol
RGP
30A
RGP
30A
50
35
50
RGP
30B
RGP
30B
100
70
100
RGP
30D
RGP
30D
200
140
200
RGP
30G
RGP
30G
400
280
400
RGP
30J
RGP
30J
600
420
600
3.0
125
100
20
–50
to +150
RGP
30G
RGP
30J
1.3
5.0
100
250
60
RGP
30K
RGP
30M
RGP
30K
RGP
30K
800
560
800
RGP
30M
RGP
30M
700
1000
RGP
30MA
RGP
30MA
1000
700
1000
Unit
1000
V
V
V
A
A
µA
°C/W
°C
Electrical Characteristics Ratings
at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Maximum instantaneous forward voltage at
3.0A
Maximum DC reverse current TA = 25°C
at rated DC blocking voltage TA = 125°C
Typical reverse recovery time (Note 1)
Typical junction capacitance at 4.0V, 1MHz
NOTES:
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A
2. Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C.B. mounted
symbol
VF
IR
trr
CJ
150
RGP
30MA
Unit
V
µA
500
300
ns
PF
RGP30A thru RGP30MA
2.Ratings and Characteristic Curves
( TA = 25°C unless otherwise noted )
Fig. 1
–
Forward Current Derating Curve
Average Forward Rectified Current (A)
60 Hz
Resistive or
Inductive Load
150
120
90
60
30
0
Fig. 2
–
Maximum Non-repetitive Peak
Forward Surge Current
TJ = TJ max
8.3ms Single Half Sine-wave
(JEDEC Method)
Average Forward Rectified Current (A)
3.0
1.5
0.375" (9.5mm) Lead Length
0
0
25
Ambient Temperature,
°C
50
75
100 125 150 175
1
Number of Cycles at 60Hz
10
100
100
Instantaneous Forward Current (A)
Fig 3.
–
Typical Instantaneous Forward
Characteristics
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
Fig 4.
–
Typical Reverse Characteristics
10
Instantaneous Reverse Current (µA)
Tj=125℃
10
1.0
Tj=75℃
1.0
0.1
Tj=25℃
0.1
0.01
0.001
0
0.01
0.6
Instantaneous Forward Voltage (V)
0.8
1.0
1.2
1.4
1.6
Percent of Rated Peak Reverse Voltage (%)
Fig 6.
–
Typical Junction Capacitance
20
40
60
80
100
100
Transient thermal impedance(°C/W)
Fig 5.
–typical
transient thermal
impedance
Junction Capacitance (pF)
20
10
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
10
1.0
0.1
0.01
t,Pulse duration,sec
0.1
1.0
10
100
1.0
0.1
Reverse Voltage (V)
1
10
100
PCB Design
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