REVISIONS
LTR
A
B
DESCRIPTION
DATE (YR-MO-DA)
94-01-18
07-02-28
APPROVED
Michael A. Frye
Joseph Rodenbeck
Changes in accordance with NOR 5962-R107-94.
Boilerplate update, part of 5 year review. ksr
ORIGINAL FIRST SHEET REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
B
15
B
16
B
17
B
18
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Rajesh Pithadia
B
19
B
20
B
21
B
1
B
22
B
2
B
23
B
3
B
24
B
4
B
25
B
5
B
26
B
6
B
7
B
8
B
9
B
10
B
11
B
12
B
13
B
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Michael Frye
DRAWING APPROVAL DATE
93-10-18
REVISION LEVEL
B
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, UV ERASABLE
PROGRAMMABLE LOGIC DEVICE,
MONOLITHIC SILICON
SIZE
CAGE CODE
A
SHEET
67268
1 OF
26
5962-93144
DSCC FORM 2233
APR 97
5962-E209-07
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
│
│
│
Federal
stock class
designator
\
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number 1/
Circuit function
128 Macrocell EPLD
128 Macrocell EPLD
Propagation delay time
35 ns
30 ns
-
│
│
│
RHA
designator
(see 1.2.1)
93144
01
│
│
│
Device
type
(see 1.2.2)
/
Q
│
│
│
Device
class
designator
(see 1.2.3)
X
│
│
│
Case
outline
(see 1.2.4)
A
│
│
│
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level
as follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
Descriptive designator
see figure 1
CMGA5-P100E
CMGA17-P100E
GQCC1-J84
Terminals
100
100
100
84
Package style
Quad flat package
Pin grid array
Pin grid array
J leaded chip carrier
2/
2/ 3/
2/ 3/
2/
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1/
2/
3/
Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in QML-38535 and MIL-HDBK-103 (see 6.6 herein).
Lid shall be transparent to permit ultraviolet light erasure.
100 = actual number of pins used, not maximum listed in MIL-STD-1835
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-93144
SHEET
B
2
1.3 Absolute maximum ratings. 4/
Supply voltage range (V
CC
) ------------------------------
Programming supply voltage range (V
PP
) -----------
DC input voltage range ------------------------------------
Maximum power dissipation -----------------------------
Lead temperature (soldering, 10 seconds) -----------
Thermal resistance, junction-to-case (θ
JC
):
Case outlines X and Y -------------------------------------
Junction temperature (T
J
) --------------------------------
Storage temperature range ------------------------------
Temperature under bias range --------------------------
Endurance-----------------------------------------------------
Data retention -----------------------------------------------
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) -------------------------------
Ground voltage (GND) --------------------------------------
Input high voltage (V
IH
) -------------------------------------
Input low voltage (V
IL
) ---------------------------------------
Case operating temperature range (T
C
) ---------------
Input rise time (t
R
) -------------------------------------------
Input fall time (t
F
) ---------------------------------------------
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
+4.5 V dc to +5.5 V dc
0 V dc
2.2 V dc minimum
0.8 V dc maximum
-55°C to +125°C 7/
100 ns maximum
100 ns maximum
See MIL-STD-1835
+175°C
-65°C to +150°C
-55°C to +125°C
25 erase/write cycles (minimum)
10 years (minimum)
-2.0 V dc to +7.0 V dc
-2.0 V dc to +13.5 V dc 5/
-2.0 V dc to +7.0 V dc 5/
2.5 W 6/
+260°C
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the
Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
4/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
5/ Minimum dc input voltage is -0.5 V. During transitions, inputs may undershoot to -2.0 V for periods less than 20 ns.
Maximum dc voltage on output pins is V
CC
+ 0.5 V, which may overshoot to +7.0 V for periods less than 20 ns under no
load conditions.
6/ Must withstand the added P
D
due to short circuit test (e.g., I
OS
).
7/ Case temperatures are instant on.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-93144
SHEET
B
3
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-00
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table shall be as specified on figure 3.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2. When required
in screening (see 4.2 herein) or qualification conformance inspection, groups A, B, or C (see 4.4), the devices shall be
programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of cells shall be programmed.
3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
drawing.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-93144
SHEET
B
4
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
3.11 Processing EPLDs. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
3.11.1 Erasure of EPLDs. When specified, devices shall be erased in accordance with the procedures and characteristics
specified in 4.6.
3.11.2 Programmability of EPLDs. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified in 4.5.
3.11.3 Verification of erasure or programmed EPLDs. When specified, devices shall be verified as either programmed (see
4.5) to the specified pattern or erased (see 4.6). As a minimum, verification shall consist of performing a functional test
(subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a
device failure, and shall be removed from the lot.
3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitor. This
reprogrammability test shall be done only for initial characterization and after any design or process changes which may affect
the reprogrammability of the device. The methods and procedures may be vendor specific, but will guarantee the number of
program/erase endurance cycles listed in section 1.3 herein. The vendors' procedure shall be under document control and shall
be made available upon request.
3.13 Data retention. A data retention stress test shall be completed as part of the vendor's reliability process. This test shall
be done initially and after any design or process change which may affect data retention. The methods and procedures may be
vendor specific, but will guarantee the number of years listed in section 1.3 herein. The vendors procedure shall be under
document control and shall be made available upon request. Data retention capability shall be guaranteed over the full military
temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-93144
SHEET
B
5
京公网安备 11010802033920号
EEWORLD
