TSPC603PVG6ME datasheet, PDF - EEWORLD Datasheet

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TSPC603PVG6ME: DescriptionRISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255; CategoryThe embedded processor and controller Microcontrollers and processors; File Size705KB，38 Pages; ManufacturerAtmel (Microchip)

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TSPC603PVG6ME Overview

RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

TSPC603PVG6ME Parametric

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	BGA
package instruction	BGA,
Contacts	255
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	66.67 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	NO
JESD-30 code	S-CBGA-B255
length	21 mm
low power mode	YES
Number of terminals	255
Maximum operating temperature	110 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	3.16 mm
speed	166 MHz
Maximum supply voltage	2.625 V
Minimum supply voltage	2.375 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	21 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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TSPC603p

PowerPC 603e™ RISC MICROPROCESSOR Family

PID7v-603e Specification

DESCRIPTION

The PID7v-603e implementation of PowerPC603e (after

named 603p) is a low-power implementation of reduced

instruction set computer (RISC) microprocessors PowerPC™

family. The 603p implements 32-bit effective addresses, inte-

ger data types of 8, 16 and 32 bits, and floating-point data types

of 32 and 64 bits.

The 603p is a low-power 2.5/3.3-volt design and provides four

software controllable power-saving modes.

The 603p is a superscalar processor capable of issuing and

retiring as many as three instructions per clock. Instructions

can execute out of order for increased performance ; however,

the 603p makes completion appear sequential. The 603p inte-

grates five execution units and is able to execute five instruc-

tions in parallel.

The 603p provides independent on-chip, 16-Kbyte, four-way

set-associative, physically addressed caches for instructions

and data and on-chip instruction and data memory manage-

ment units (MMUs). The MMUs contain 64-entry, two-way set-

associative, data and instruction translation lookaside buffers

that provide support for demand-paged virtual memory

address translation and variable-sized block translation.

The 603p has a selectable 32 or 64-bit data bus and a 32-bit

address bus. The 603p interface protocol allows multiple mas-

ters to complete for system resources through a central exter-

nal arbiter. The 603p supports single-beat and burst data

transfers for memory accesses, and supports memory-

mapped I/O.

The 603p uses an advanced, 2.5/3.3-V CMOS process tech-

nology and maintains full interface compatibility with TTL devi-

ces.

The 603p integrates in system testability and debugging fea-

tures through JTAG boundary-scan capability.

CERQUAD 240

A suffix

CERQUAD 240

Ceramic Leaded Chip Carrier

MAIN FEATURES

4.0 SPECint95, 5.3 SPECfp95 @ 166 MHz (estimated)

Superscalar (3 instructions per clock peak).

Dual 16KB caches.

Selectable bus clock.

32-bit compatibility PowerPC implementation.

On chip debug support.

typical = 3.0 Watts (166 MHz), full operating conditions.

Nap, doze and sleep modes for power savings.

Branch folding.

64-bit data bus (32-bit data bus option).

4-Gbyte direct addressing range.

Pipelined single/double precision float unit.

IEEE 754 compatible FPU.

IEEE P 1149-1 test mode (JTAG/C0P).

int

max = 166 MHz. (200 MHz planned).

bus

max = 66.67 MHz.

Compatible CMOS input / TTL Output.

G suffix

CBGA 255

Ceramic Ball Grid Array

(To be introduced)

SCREENING / QUALITY / PACKAGING

This product is manufactured in full compliance with :

MIL-STD-883 class B or According to TCS standards

(planned)

Upscreenings based upon TCS standards

Full military temperature range (T

= -55°C, Tc= +125°C)

Industrial temperature range (T

–

40°C, T

= +110°C)

Internal // I/O Power Supply = 2.5

5 % // 3.3 V

5 %.

240 pin Cerquad or 255 pin CBGA packages

June 1998

1/38

TSPC603p

A. GENERAL DESCRIPTION

Fetch

Unit

Completion

Unit

Dispatch

Unit

Branch

Unit

Integer

Unit

Gen

Reg

Unit

Gen

Re-

name

Load/

Store

Unit

Re-

name

Reg

File

Float

Unit

D MMU

16K Data Cache

I MMU

16K Inst. Cache

Bus Interface Unit

32b

address

64b

data

System Bus

Figure 1 : Block diagram

1. INTRODUCTION

The 603p is a low-power implementation of the PowerPC microprocessor family of reduced instruction set commuter (RISC) micro-

processors. The 603p implements the 32-bit portion of the PowerPC architecture, which provides 32-bit effective addresses, integer

data types of 8, 16 and 32 bits, and floating-point data types of 32 and 64 bits. For 64-bit PowerPC microprocessors, the PowerPC

architecture provides 64-bit integer data types, 64-bit addressing, and other features required to complete the 64-bit architecture.

The 603p provides four software controllable power-saving modes. Three of the modes (the nap, doze, and sleep modes) are static in

nature, and progressively reduce the amount of power dissipated by the processor. The fourth is a dynamic power management

mode that causes the functional units in the 603p to automatically enter a low-power mode when the functional units are idle without

affecting operational performance, software execution, or any external hardware.

The 603p is a superscalar processor capable of issuing and retiring as many as three instructions per clock. Instructions can execute

out of order for increased performance ; however, the 603p makes completion appear sequential.

The 603 e integrates five execution units - an integer unit (IU), a floating-point unit (FPU), a branch processing unit (BPU), a load/store

unit (LSU) and a system register unit (SRU). The ability to execute five instructions in parallel and the use of simple instructions with

rapid execution times yield high efficiency and throughput for 603p-based systems. Most integer instructions execute in one clock

cycle. The FPU is pipelined so a single-precision multiply-add instruction can be issued every clock cycle.

The 603p provides independent on-chip, 16 Kbyte, four-way set-associative, physically addressed caches for instructions and data

and on-chip instruction and data memory management units (MMUs). The MMUs contain 64-entry, two-way set-associative, data

and instruction translation lookaside buffers (DTLB and ITLB) that provide support for demand-paged virtual memory address

translation and variable-sized block translation. The TLBs and caches use a least recently used (LRU) replacement algorithm. The

603p also supports block address translation through the use of two independent instruction and data block address translation (IBAT

and DBAT) arrays of four entries each. Effective addresses are compared simultaneously with all four entries in the BAT array during

block translation. In accordance with the PowerPC architecture, if an effective address hits in both the TLB and BAT array, the BAT

translation takes priority.

The 603p has a selectable 32 - or 64-bit - data bus and a 32-bit address bus. The 603p interface protocol allows multiple masters to

compete for system resources through a central external arbiter. The 603p provides a three-state coherency protocol that supports

the exclusive, modified, and invalid cache states. This protocol as a compatible subset of the MESI (modified/exclusive/shared/in-

valid) four-state protocol and operates coherently in systems that contain four-state caches. The 603p supports single-beat and burst

data transfers for memory accesses, and supports memory-mapped I/O.

The 603p uses an advanced, 0.35

5 metal layer CMOS process technology and maintains full interface compatibility with TTL

devices.

3/38

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