LRS1322 datasheet, PDF - EEWORLD Datasheet

LRS1322: DescriptionMemory Circuit, 16MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72; Categorystorage storage; File Size2MB，52 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LRS1322 Overview

Memory Circuit, 16MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	8 X 11 MM, PLASTIC, CSP-72
Reach Compliance Code	unknown
JESD-30 code	R-PBGA-B72
JESD-609 code	e0
length	11 mm
memory density	268435456 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	72
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

RELIMINARY

RODUCT

PECIFICATIONS

Integrated Circuits Group

LRS1322

Stacked Chip

16M (×16) Flash Memory and 2M (×16) SRAM

(Model No.: LRS1322)

Spec No.: MFM2-J10604A

Issue Date: October 12, 1998

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