EMVA13AB2-53.760M
Series
RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD
3.3Vdc LVCMOS Voltage Controlled MEMS Oscillator
Frequency Tolerance/Stability
±50ppm Maximum
Operating Temperature Range
-40°C to +85°C
RoHS
Pb
EMVA13 A B 2 -53.760M
Nominal Frequency
53.760MHz
Absolute Pull Range
±50ppm Minimum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
53.760MHz
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
260°C Reflow, Shock, and Vibration)
±1ppm Maximum First Year
-40°C to +85°C
3.3Vdc ±10%
15mA Maximum
90% of Vdd Minimum (IOH = -4mA)
10% of Vdd Maximum (IOL = +4mA)
2nSec Maximum (Measured from 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
±50ppm Minimum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and First
Year Aging at 25°C over the Control Voltage (Vc).)
0.05Vdc to 1.7Vdc (Test Condition for APR)
0.0Vdc to 1.8Vdc
1% Maximum
Positive Transfer Characteristic
8kHz Typical, 5kHz Minimum (Measured at -3dB, Vc = 0.875Vdc)
250kOhms Minimum
10µA Maximum
-100dBc/Hz at offset of 10kHz, -115dBc/Hz at offset of 100kHz, -145dBc/Hz at offset of 1MHz, and -
154dBc/Hz at offset of 10MHz
3pSec Typical, 6pSec Maximum
20pSec Typical, 40pSec Maximum
0.8pSec Typical
0.6pSec Typical
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Absolute Pull Range
Control Voltage
Control Voltage Range
Linearity
Transfer Function
Modulation Bandwidth
Input Impedance
Input Leakage Current
Typical Phase Noise at Offsets
Period Jitter (RMS)
Period Jitter (pk-pk)
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random)
RMS Phase Jitter (Fj = 900kHz to
7.5MHz; Random)
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 3015, Class 2, HBM 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 5
EMVA13AB2-53.760M
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Control Voltage
Case Ground
Output
Supply Voltage
5.00
±0.15
0.85
±0.15
0.08
MAX
2
1.20 ±0.10 (x4)
2.1
3
R0.70 ±0.10
1.70
1
2
3
4
LINE MARKING
7.00
±0.15
5.08
±0.10
1
C0.25 ±0.10
2.60 ±0.15
A
4
1
XXXX or XXXXX
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 2).
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 5
EMVA13AB2-53.760M
OUTPUT WAVEFORM
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
Ground
Voltage
Control
C
L
(Note 3)
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 5
EMVA13AB2-53.760M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 5
PCB Design
京公网安备 11010802033920号
EEWORLD
