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S71GL128NB0BAW9Z3

Description
Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HIEGHT, FBGA-64
Categorystorage    storage   
File Size3MB,147 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S71GL128NB0BAW9Z3 Overview

Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HIEGHT, FBGA-64

S71GL128NB0BAW9Z3 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts64
Reach Compliance Codecompliant
Other featuresPSRAM IS ORGANIZED AS 2M X 16
JESD-30 codeR-PBGA-B64
JESD-609 codee0
length11.6 mm
memory density134217728 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals64
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.1 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
S71GL512NB0/S71GL256NB0/
S71GL128NB0
Stacked Multi-chip Product (MCP)
512/256/128 Megabit (32/16/8 M x 16-bit) CMOS 3.0 Volt-only
MirrorBit
TM
Page-mode Flash Memory with
32 Megabit (2M x 16-bit) pSRAM
ADVANCE
INFORMATION
Distinctive Characteristics
MCP Features
Power supply voltage of 2.7 to 3.1V
High Performance
90 ns access time (S71GL128N, S71GL256N)
100 ns access time (S71GL512N)
25 ns page read times
Packages:
— 9.0 x 12.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)
— 8.0 x 11.6 mm x 1.2 mm FBGA (TLA084) (S71GL128N, S71GL256N)
Operating Temperature
— -25°C to +85°C (Wireless)
— -40°C to +85°C (Industrial)
General Description
The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages
and consists of
One Flash memory die
one pSRAM
The products covered by this document are listed in the table below. For details
about their specifications, please refer to the individual constituent datasheets
for further details.
Flash Memory Density
512 Mb
128 Mb
pSRAM Density
64 Mb
32 Mb
16 Mb
S71GL512NB0
S71GL256NB0
S71GL128NB0
256 Mb
128 Mb
Publication Number
S71GL512_256_128NB0_00
Revision
A
Amendment
1
Issue Date
December 7, 2004
This document contains information on a product under development at Spansion LLC. The information is intended to help you evaluate this product. Spansion LLC
reserves the right to change or discontinue work on this proposed product without notice.

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