TS5A23167YEPR datasheet, PDF - EEWORLD Datasheet

TS5A23167YEPR: DescriptionDUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BGA8, DSBGA-8; CategoryAnalog mixed-signal IC The signal circuit; File Size663KB，30 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TS5A23167YEPR Overview

DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BGA8, DSBGA-8

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA, BGA8,2X4,20
Contacts	8
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	R-XBGA-B8
length	1.9 mm
normal position	NC
Number of channels	1
Number of functions	2
Number of terminals	8
Nominal off-state isolation	62 dB
On-state resistance matching specifications	0.04 Ω
Maximum on-state resistance (Ron)	3.9 Ω
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA8,2X4,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
power supply	1.8/5 V
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
Maximum disconnect time	15.5 ns
Maximum connection time	18 ns
switch	BREAK-BEFORE-MAKE
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	0.9 mm

	TS5A23167YEPR	TS5A23167DCTR
Description	DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BGA8, DSBGA-8	DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, SSOP-8
Parts packaging code	BGA	SOIC
package instruction	VFBGA, BGA8,2X4,20	LSSOP, SSOP8,.16
Contacts	8	8
Reach Compliance Code	unknown	unknown
Analog Integrated Circuits - Other Types	SPST	SPST
JESD-30 code	R-XBGA-B8	R-PDSO-G8
length	1.9 mm	2.95 mm
normal position	NC	NC
Number of channels	1	1
Number of functions	2	2
Number of terminals	8	8
Nominal off-state isolation	62 dB	62 dB
On-state resistance matching specifications	0.04 Ω	0.04 Ω
Maximum on-state resistance (Ron)	3.9 Ω	3.9 Ω
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	VFBGA	LSSOP
Encapsulate equivalent code	BGA8,2X4,20	SSOP8,.16
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
power supply	1.8/5 V	1.8/5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	0.5 mm	1.3 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
Maximum disconnect time	15.5 ns	15.5 ns
Maximum connection time	18 ns	18 ns
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING
Terminal pitch	0.5 mm	0.65 mm
Terminal location	BOTTOM	DUAL
width	0.9 mm	2.8 mm

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