N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR

| STP32N06 | STP36N06 | STP36N06FI | STP32N06L | STP32N06LFI | |
|---|---|---|---|---|---|
| Description | N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR | N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR | N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR | N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR | N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR |
| Is it lead-free? | - | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to |
| Parts packaging code | - | TO-220AB | TO-220AB | TO-220AB | TO-220AB |
| package instruction | - | FLANGE MOUNT, R-PSFM-T3 | ISOWATT220, 3 PIN | TO-220, 3 PIN | ISOWATT220, 3 PIN |
| Contacts | - | 3 | 3 | 3 | 3 |
| Reach Compliance Code | - | compli | _compli | _compli | _compli |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Avalanche Energy Efficiency Rating (Eas) | - | 220 mJ | 220 mJ | 180 mJ | 180 mJ |
| Configuration | - | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | - | 60 V | 60 V | 60 V | 60 V |
| Maximum drain current (Abs) (ID) | - | 36 A | 21 A | 32 A | 19 A |
| Maximum drain current (ID) | - | 36 A | 21 A | 32 A | 19 A |
| Maximum drain-source on-resistance | - | 0.04 Ω | 0.04 Ω | 0.055 Ω | 0.055 Ω |
| FET technology | - | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code | - | TO-220AB | TO-220AB | TO-220AB | TO-220AB |
| JESD-30 code | - | R-PSFM-T3 | R-PSFM-T3 | R-PSFM-T3 | R-PSFM-T3 |
| JESD-609 code | - | e3 | e3 | e3 | e3 |
| Number of components | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | 3 | 3 | 3 | 3 |
| Operating mode | - | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
| Maximum operating temperature | - | 175 °C | 175 °C | 175 °C | 175 °C |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | - | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
| Maximum power dissipation(Abs) | - | 120 W | 40 W | 105 W | 40 W |
| Maximum pulsed drain current (IDM) | - | 144 A | 144 A | 128 A | 128 A |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | - | NO | NO | NO | NO |
| Terminal surface | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | - | SINGLE | SINGLE | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | - | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | - | SILICON | SILICON | SILICON | SILICON |
| Maker | - | - | STMicroelectronics | STMicroelectronics | STMicroelectronics |