AM2964BXC datasheet, PDF - EEWORLD Datasheet

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AM2964BXC: Description176KX8, DRAM CONTROLLER, UUC40, 0.156 X 0.143 INCH, DIE-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，15 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM2964BXC Overview

176KX8, DRAM CONTROLLER, UUC40, 0.156 X 0.143 INCH, DIE-40

AM2964BXC Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	0.156 X 0.143 INCH, DIE-40
Contacts	40
Reach Compliance Code	unknow
Address bus width	16
boundary scan	NO
External data bus width
JESD-30 code	R-XUUC-N40
low power mode	NO
memory organization	176K X 8
Number of blocks	4
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
uPs/uCs/peripheral integrated circuit type	MEMORY CONTROLLER, DRAM
Base Number Matches	1

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AM2964BXC Related Products

	AM2964BXC	AM2964B/BUA	AM2964BDC	AM2964BPC	AM2964B/BQA	AM2964BLC
Description	176KX8, DRAM CONTROLLER, UUC40, 0.156 X 0.143 INCH, DIE-40	DRAM Controller, 176K X 8, CMOS, CQCC44, CERAMIC, LCC-44	DRAM Controller, 176K X 8, CMOS, CDIP40, CERDIP-40	DRAM Controller, 176K X 8, CMOS, PDIP40, PLASTIC, DIP-40	DRAM Controller, 176K X 8, CMOS, CDIP40, CERDIP-40	176KX8, DRAM CONTROLLER, CQCC44, CERAMIC, LCC-44
Parts packaging code	DIE	LCC	DIP	DIP	DIP	LCC
package instruction	0.156 X 0.143 INCH, DIE-40	QCCN,	DIP, DIP40,.6	DIP, DIP40,.6	DIP,	CERAMIC, LCC-44
Contacts	40	44	40	40	40	44
Reach Compliance Code	unknow	unknow	unknown	unknown	unknown	unknown
Address bus width	16	16	16	16	16	16
boundary scan	NO	NO	NO	NO	NO	NO
JESD-30 code	R-XUUC-N40	S-CQCC-N44	R-GDIP-T40	R-PDIP-T40	R-GDIP-T40	S-CQCC-N44
low power mode	NO	NO	NO	NO	NO	NO
memory organization	176K X 8	176K X 8	176K X 8	176K X 8	176K X 8	176K X 8
Number of blocks	4	4	4	4	4	4
Number of terminals	40	44	40	40	40	44
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	125 °C	70 °C
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIE	QCCN	DIP	DIP	DIP	QCCN
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	UNCASED CHIP	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
Maximum supply voltage	5.25 V	5.5 V	5.25 V	5.25 V	5.5 V	5.25 V
Minimum supply voltage	4.75 V	4.5 V	4.75 V	4.75 V	4.5 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	UPPER	QUAD	DUAL	DUAL	DUAL	QUAD
uPs/uCs/peripheral integrated circuit type	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM
Base Number Matches	1	1	1	1	-	-
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible
length	-	16.51 mm	52.2605 mm	52.324 mm	52.2605 mm	16.51 mm
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	-	2.54 mm	5.588 mm	5.715 mm	5.588 mm	2.54 mm
Terminal pitch	-	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	16.51 mm	15.24 mm	15.24 mm	15.24 mm	16.51 mm
Maker	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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