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AT27C020-20JC

Description
OTP ROM, 256KX8, 200ns, CMOS, PQCC32
Categorystorage    storage   
File Size483KB,7 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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AT27C020-20JC Overview

OTP ROM, 256KX8, 200ns, CMOS, PQCC32

AT27C020-20JC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrochip
package instructionPLASTIC, LCC-32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density2097152 bit
Memory IC TypeOTP ROM
memory width8
Humidity sensitivity level2
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Maximum seat height3.55 mm
Maximum standby current0.0001 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width11.43 mm

AT27C020-20JC Related Products

AT27C020-20JC AT27C020-20PC AT27C020-20JI AT27C020-20PI
Description OTP ROM, 256KX8, 200ns, CMOS, PQCC32 OTP ROM, 256KX8, 200ns, CMOS, PDIP32 OTP ROM, 256KX8, 200ns, CMOS, PQCC32 OTP ROM, 256KX8, 200ns, CMOS, PDIP32
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction PLASTIC, LCC-32 0.600 INCH, PLASTIC, DIP-32 PLASTIC, LCC-32 0.600 INCH, PLASTIC, DIP-32
Reach Compliance Code unknown unknow not_compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 200 ns 200 ns 200 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-PDIP-T32 R-PQCC-J32 R-PDIP-T32
JESD-609 code e0 e0 e0 e0
length 13.97 mm 42.05 mm 13.97 mm 42.05 mm
memory density 2097152 bit 2097152 bi 2097152 bit 2097152 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C
organize 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ DIP QCCJ DIP
Encapsulate equivalent code LDCC32,.5X.6 DIP32,.6 LDCC32,.5X.6 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 NOT SPECIFIED 225 NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.55 mm 5.59 mm 3.55 mm 5.59 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.025 mA 0.025 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO YES NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form J BEND THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL QUAD DUAL
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 NOT SPECIFIED
width 11.43 mm 15.24 mm 11.43 mm 15.24 mm
Maker Microchip Microchip - Microchip
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