OTP ROM, 256KX8, 200ns, CMOS, PDIP32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| package instruction | 0.600 INCH, PLASTIC, DIP-32 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| length | 42.05 mm |
| memory density | 2097152 bi |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.59 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.025 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| AT27C020-20PC | AT27C020-20JI | AT27C020-20PI | AT27C020-20JC | |
|---|---|---|---|---|
| Description | OTP ROM, 256KX8, 200ns, CMOS, PDIP32 | OTP ROM, 256KX8, 200ns, CMOS, PQCC32 | OTP ROM, 256KX8, 200ns, CMOS, PDIP32 | OTP ROM, 256KX8, 200ns, CMOS, PQCC32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | 0.600 INCH, PLASTIC, DIP-32 | PLASTIC, LCC-32 | 0.600 INCH, PLASTIC, DIP-32 | PLASTIC, LCC-32 |
| Reach Compliance Code | unknow | not_compliant | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 200 ns | 200 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDIP-T32 | R-PQCC-J32 | R-PDIP-T32 | R-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 42.05 mm | 13.97 mm | 42.05 mm | 13.97 mm |
| memory density | 2097152 bi | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | DIP | QCCJ |
| Encapsulate equivalent code | DIP32,.6 | LDCC32,.5X.6 | DIP32,.6 | LDCC32,.5X.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.59 mm | 3.55 mm | 5.59 mm | 3.55 mm |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.025 mA | 0.03 mA | 0.03 mA | 0.025 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 |
| width | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm |
| Maker | Microchip | - | Microchip | Microchip |
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