MN5909CDH datasheet, PDF - EEWORLD Datasheet

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MN5909CDH: DescriptionADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20; CategoryAnalog mixed-signal IC converter; File Size2MB，4 Pages; ManufacturerSpectrum Microwave

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MN5909CDH Overview

ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20

MN5909CDH Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Spectrum Microwave
Objectid	1402334610
Parts packaging code	DIP
package instruction	DIP, DIP20,.3
Contacts	20
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
compound_id	5119727
Maximum analog input voltage	7.5 V
Minimum analog input voltage	-0.5 V
Converter type	ADC, FLASH METHOD
JESD-30 code	R-CDIP-T20
JESD-609 code	e0
length	25.4 mm
Maximum linear error (EL)	1.6%
Number of analog input channels	1
Number of digits	6
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output bit code	BINARY
Output format	PARALLEL, 8 BITS
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Sampling rate	100 MHz
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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MN5909CDH Related Products

	MN5909CDH	MN5909PDE	MN5909CDH/B	MN5909CDE	MN5909PD	MN5909CD
Description	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, CERAMIC, DIP-20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Spectrum Microwave	Spectrum Microwave	Spectrum Microwave	Spectrum Microwave	Spectrum Microwave	Spectrum Microwave
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Contacts	20	20	20	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknow	unknow	unknow
ECCN code	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99	EAR99	EAR99
Maximum analog input voltage	7.5 V	7.5 V	7.5 V	7.5 V	7.5 V	7.5 V
Minimum analog input voltage	-0.5 V	-0.5 V	-0.5 V	-0.5 V	-0.5 V	-0.5 V
Converter type	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD
JESD-30 code	R-CDIP-T20	R-PDIP-T20	R-CDIP-T20	R-CDIP-T20	R-PDIP-T20	R-CDIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0
length	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.2 mm	25.4 mm
Maximum linear error (EL)	1.6%	1.6%	1.6%	1.6%	1.6%	1.6%
Number of analog input channels	1	1	1	1	1	1
Number of digits	6	6	6	6	6	6
Number of functions	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20
Maximum operating temperature	125 °C	85 °C	125 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-25 °C	-55 °C	-25 °C	-	-
Output bit code	BINARY	BINARY	BINARY	BINARY	BINARY	BINARY
Output format	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Sampling rate	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	OTHER	MILITARY	OTHER	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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