ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, CERAMIC, DIP-20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Spectrum Microwave |
| Parts packaging code | DIP |
| package instruction | DIP, DIP20,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum analog input voltage | 7.5 V |
| Minimum analog input voltage | -0.5 V |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | R-CDIP-T20 |
| JESD-609 code | e0 |
| length | 25.4 mm |
| Maximum linear error (EL) | 1.6% |
| Number of analog input channels | 1 |
| Number of digits | 6 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output bit code | BINARY |
| Output format | PARALLEL, 8 BITS |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Sampling rate | 100 MHz |
| Maximum seat height | 4.29 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MN5909CD | MN5909PDE | MN5909CDH | MN5909CDH/B | MN5909CDE | MN5909PD | |
|---|---|---|---|---|---|---|
| Description | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, CERAMIC, DIP-20 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknow | unknow |
| ECCN code | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 |
| Maximum analog input voltage | 7.5 V | 7.5 V | 7.5 V | 7.5 V | 7.5 V | 7.5 V |
| Minimum analog input voltage | -0.5 V | -0.5 V | -0.5 V | -0.5 V | -0.5 V | -0.5 V |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | R-CDIP-T20 | R-PDIP-T20 | R-CDIP-T20 | R-CDIP-T20 | R-CDIP-T20 | R-PDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.2 mm |
| Maximum linear error (EL) | 1.6% | 1.6% | 1.6% | 1.6% | 1.6% | 1.6% |
| Number of analog input channels | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of digits | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 85 °C | 125 °C | 125 °C | 85 °C | 70 °C |
| Minimum operating temperature | - | -25 °C | -55 °C | -55 °C | -25 °C | - |
| Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Sampling rate | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | OTHER | MILITARY | MILITARY | OTHER | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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