Decoder/Driver, TTL, CDFP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | OTHER DECODER/DRIVER |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| 7448FCQM | 54LS48DMQB | 74LS48FCQM | 74LS48FCQR | 74LS48PCQR | 7448PCQM | 7448PCQR | 7448FCQR | |
|---|---|---|---|---|---|---|---|---|
| Description | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, CDIP16, | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, PDIP16, | Decoder/Driver, TTL, PDIP16, | Decoder/Driver, TTL, PDIP16, | Decoder/Driver, TTL, CDFP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | compliant | compliant | compli |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | R-XDFP-F16 | R-XDFP-F16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DFP | DIP | DFP | DFP | DIP | DIP | DIP | DFP |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| surface mount | YES | NO | YES | YES | NO | NO | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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