EEWORLDEEWORLDEEWORLD

Part Number

Search

N74H108F

Description
J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDIP14
Categorylogic    logic   
File Size135KB,2 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

N74H108F Overview

J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDIP14

N74H108F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeJ-K FLIP-FLOP
Maximum Frequency@Nom-Sup40000000 Hz
MaximumI(ol)0.02 A
Number of functions2
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Maximum supply current (ICC)76 mA
Certification statusNot Qualified
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Trigger typeNEGATIVE EDGE

N74H108F Related Products

N74H108F N74H108A S54H108W S54H108W/883B N74H108FB
Description J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDIP14 J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, PDIP14 J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDFP14 J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDFP14 J-K Flip-Flop, 2-Func, Negative Edge Triggered, TTL, CDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DFP, FL14,.3 DFP, FL14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknow
JESD-30 code R-XDIP-T14 R-PDIP-T14 R-XDFP-F14 R-XDFP-F14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP
MaximumI(ol) 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A
Number of functions 2 2 2 2 2
Number of terminals 14 14 14 14 14
Maximum operating temperature 70 °C 70 °C 125 °C 125 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DFP DFP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 FL14,.3 FL14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE FLATPACK FLATPACK IN-LINE
Maximum supply current (ICC) 76 mA 76 mA 76 mA 76 mA 76 mA
surface mount NO NO YES YES NO
technology TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE FLAT FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Trigger type NEGATIVE EDGE NEGATIVE EDGE NEGATIVE EDGE NEGATIVE EDGE NEGATIVE EDGE
Maximum Frequency@Nom-Sup 40000000 Hz 40000000 Hz 40000000 Hz 40000000 Hz -
Certification status Not Qualified - Not Qualified Not Qualified -
Earn points, settle quickly
...
jxrth Embedded System
【Repost】Understand the characteristics and process of BGA packaging technology in one article
[align=left][font=微软雅黑]As the market's requirements for chip integration increase, the number of I/O pins increases dramatically, power consumption also increases, and integrated circuit packaging bec...
皇华Ameya360 Power technology
As the flower grows, the pot also grows
When the plant is still a seedling, we can use a small flower pot, which is enough for its growth space. When it grows slowly, we need to change the pot several times to give it more room to grow. Of ...
xyh_521 Creative Market
About posting
I would like to ask, why was my post deleted?...
寒霜 51mcu
Newbie help..... Bluetooth issues encountered when using PB5.0 build image. . . . . . .
Describe the problem: After installing the image on the development board, I can receive files uploaded from other bluetooth devices, but I cannot transmit files from the development board. The object...
ggyggu Embedded System
EEPROM of MSP430
My pressure indicator needs to be able to set upper and lower limits. After the upper and lower limits are set, they need to be saved and valid for the next boot. I use msp430f149. Should I use intern...
王阿东 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 626  1167  2719  1619  2213  13  24  55  33  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号