Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NEC Electronics |
| Objectid | 1426627794 |
| package instruction | 14 X 14 MM, PLASTIC, QFP-64 |
| Reach Compliance Code | compliant |
| compound_id | 293901846 |
| Has ADC | YES |
| Address bus width | 16 |
| bit size | 8 |
| maximum clock frequency | 10 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e0 |
| length | 14 mm |
| Number of I/O lines | 53 |
| Number of terminals | 64 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| Maximum seat height | 2.85 mm |
| speed | 10 MHz |
| Maximum slew rate | 22.5 mA |
| Maximum supply voltage | 6 V |
| Minimum supply voltage | 2.7 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| UPD78013YGC-XXX-AB8 | UPD78011BYCW-XXX | UPD78011BYGC-XXX-AB8 | UPD78012BYCW-XXX | UPD78014YGC-XXX-AB8 | UPD78013YCW-XXX | UPD78012BYGC-XXX-AB8 | |
|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PDIP64, 0.750 INCH, PLASTIC, SHRINK, DIP-64 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PDIP64, 0.750 INCH, PLASTIC, SHRINK, DIP-64 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PDIP64, 0.750 INCH, PLASTIC, SHRINK, DIP-64 | Microcontroller, 8-Bit, MROM, 10MHz, CMOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | 14 X 14 MM, PLASTIC, QFP-64 | 0.750 INCH, PLASTIC, SHRINK, DIP-64 | 14 X 14 MM, PLASTIC, QFP-64 | 0.750 INCH, PLASTIC, SHRINK, DIP-64 | 14 X 14 MM, PLASTIC, QFP-64 | 0.750 INCH, PLASTIC, SHRINK, DIP-64 | 14 X 14 MM, PLASTIC, QFP-64 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Has ADC | YES | YES | YES | YES | YES | YES | YES |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | S-PQFP-G64 | R-PDIP-T64 | S-PQFP-G64 | R-PDIP-T64 | S-PQFP-G64 | R-PDIP-T64 | S-PQFP-G64 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 14 mm | 57.655 mm | 14 mm | 57.655 mm | 14 mm | 57.655 mm | 14 mm |
| Number of I/O lines | 53 | 53 | 53 | 53 | 53 | 53 | 53 |
| Number of terminals | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM channel | YES | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | SDIP | QFP | SDIP | QFP | SDIP | QFP |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| Maximum seat height | 2.85 mm | 5.08 mm | 2.85 mm | 5.08 mm | 2.85 mm | 5.08 mm | 2.85 mm |
| speed | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| Maximum slew rate | 22.5 mA | 22.5 mA | 22.5 mA | 22.5 mA | 22.5 mA | 22.5 mA | 22.5 mA |
| Maximum supply voltage | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| surface mount | YES | NO | YES | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 0.8 mm | 1.778 mm | 0.8 mm | 1.778 mm | 0.8 mm | 1.778 mm | 0.8 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 14 mm | 19.05 mm | 14 mm | 19.05 mm | 14 mm | 19.05 mm | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Maker | NEC Electronics | - | - | - | NEC Electronics | NEC Electronics | NEC Electronics |
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