3
1. Characteristics
a) Absolute Maximum Rating
Item
Ambient / Operating Temperature
Symbol
T
a
Rating
-40 ~ +85
Unit
℃
Condition
-
Storage Temperature
T
stg
-40 ~ +120
℃
-
LED Junction Temperature
T
j
110
℃
-
Forward Current
I
F
200
mA
-
Pulse Forward Current
I
FP
300
260
<10
5
mA
℃
s
kV
Duty 1/10, pulse width 10ms
Assembly Process Temperature
-
-
ESD (HBM)
-
-
b) Electro-optical Characteristics
(I
F
= 65 mA, Ts = 25℃)
Item
Unit
Rank
Bin
AY
Min.
2.6
2.7
2.8
0.7
80
-
-
Typ.
-
-
-
-
-
7.5
120
Max.
2.7
2.8
2.9
1.2
-
-
-
Forward Voltage (V
F
)
V
XA
AZ
A1
Reverse Voltage
(@ 5 mA)
Color Rendering Index (R
a
)
Thermal Resistance
(junction to solder point)
Beam Angle
V
-
℃/W
○
Note:
Samsung maintains measurement tolerance of:
forward voltage = ±0.1 V, luminous flux = ±5 %, CRI = ±3
5
2. Product Code Information
1
S
Digit
1 2
4 5
6
7 8
10
11
12
9
3
2
P
3
M
4
W
5
H
6
D
7
3
Code
SPM
WH
D
32A
M
D
5
8
2
9
A
10
M
11
D
12
5
13
X
Specification
14
A
15
R
16
0
17
S
18
0
PKG Information
Samsung Package Middle Power
Color
Product Version
Form Factor
Sorting Current (mA)
Chromaticity Coordinates
CRI
White
Dispensing
3.0 x 3.0 x 0.7 mm;
65 mA
ANSI Standard, MacAdam 3 step ellipse bin, MacAdam 5 step ellipse bin
Min. 80
2.6~2.9
Bin
Code:
AY
AZ
A1
2.6~2.7
2.7~2.8
2.8~2.9
2 pads;
13
14
Forward Voltage (V)
XA
W
●
V
●
U
●
T
●
15
16
CCT (K)
R
●
Q
●
P
●
2700
WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM, W3
3000
VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM, V3
3500
Bin
Code:
UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM, U3
4000
TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM, T3
5000
RA, RB, RC, RD, RE, RF, RG, RH, RJ, RK, RL, RM, R3
5700
QA, QB, QC, QD, QE, QF, QG, QH, QJ, QK, QL, QM, Q3
6500
PA, PB, PC, PD, PE, PF, PG, PH, PJ, PK, PL, PM, P3
●
:
"0" (Whole bin) "3" (MacAdam 3-step ellipse bin)
or "K” (K Kitting) or “S” (S Kitting)
S0
SH
17
18
Luminous Flux
SJ
SK
SL
Bin
Code:
SH, SJ, SK, SL, SM
SH
SJ
SK
SL