LXZ1-3080-Y datasheet, PDF - EEWORLD Datasheet

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LXZ1-3080-Y: DescriptionSINGLE COLOR LED; CategoryLED optoelectronic/LED; File Size2MB，14 Pages; ManufacturerLumileds; Websitehttps://www.lumileds.com/

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LXZ1-3080-Y Overview

SINGLE COLOR LED

LXZ1-3080-Y Parametric

Parameter Name	Attribute value
state	Active
Optoelectronic device type	SINGLE COLOR LED

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ILLUMINATION

LUXEON Z

Assembly and Handling Information

Introduction

This application brief addresses the recommended assembly and handling

procedures for LUXEON Z emitters. Proper assembly, handling, and thermal

management, as outlined in this application brief, ensure high optical output and

long lumen maintenance for LUXEON Z emitters.

Scope

The assembly and handling guidelines in this application brief apply to the following

products:

LUXEON Z White (all CCT & CRI)

LUXEON Z Lime (LXZ1-PX01)

LUXEON Z Green (LXZ1-PM01)

LUXEON Z Cyan (LXZ1-PE01)

LUXEON Z Blue (LXZ1-PB01)

LUXEON Z Royal Blue (LXZ1-PR01)

LUXEON Z Deep Red (LXZ1-PA01)

LUXEON Z Red (LXZ1-PD01)

LUXEON Z Red-Orange (LXZ1-PH01)

LUXEON Z Amber (LXZ1-PL01)

In the remainder of this document the term LUXEON Z refers to any product in the

LUXEON Z product family.

Table of Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1 . Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.2 Optical Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.3 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

1.5 Electrical Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

1.6 Mechanical Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

1.7 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2 . Printed Circuit Board Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.1 Footprint and Land Pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.2 Surface Finishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.3 Minimum Spacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

3 . Thermal Measurement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

4 . Assembly Process Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

4.1 Stencil Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

4.2 Pick-and-Place . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

4.3 Reflow Accuracy.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

5 . Packaging Considerations – Chemical Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

About Lumileds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 4. Correct handling (top) and incorrect handling (bottom) of LUXEON Z emitters.

When handling finished boards containing LUXEON Z emitters, do not touch the top surface with any fingers (see Figure

5a) or apply any pressure to it. Also, do no turn over the board for probing, if the electrodes are at the back of the board,

or stack multiple boards on top of each other (see Figure 5b). A rough or contaminated surface, which is placed on top of a

LUXEON Z emitter, may damage the silicone overcoat of the emitter. Furthermore, any pressure applied onto the LUXEON

Z emitter during probing may damage the silicone layer or the chip underneath.

1.4 Cleaning

The LUXEON Z emitter should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease

in optical output. In the event that the surface of a LUXEON Z emitter requires cleaning, a compressed gas duster at a

distance of 6” away will be sufficient to remove the dust and debris or an air gun with 20 psi (at nozzle) from a distance of

6”. Make sure the parts are secured first.

1.5 Electrical Isolation

The LUXEON Z emitter contains only two electrical pads on the bottom of the ceramic substrate with a spacing of 0.25mm

between them. In order to avoid any electrical shocks and/or damage to the LUXEON Z emitter, each design needs to

comply with the appropriate standards of safety and isolation distances, known as clearance and creepage distances,

respectively (e.g. IEC60950, clause 2.10.4).

1.6 Mechanical Files

Mechanical drawings for LUXEON Z (2D and 3D) are available upon request.

1.7 Soldering

LUXEON Z emitters are designed to be soldered onto a Printed Circuit Board (PCB). For detailed assembly instructions, see

Section 2. substrate as shown in Figure 4.

Figure 5. Do not touch the top of surface of the LUXEON Z emitter when handling a finished board (a) or stack

boards with one or more LUXEON Z emitters on top of each other (b).

LXZ1-3080-Y Related Products

	LXZ1-3080-Y	LXZ1-2780-Y	LXZ1-4080-Y	LXZ2-2780-Y	LXZ2-2790-Y	LXZ2-3080-Y	LXZ2-3090-Y	LXZ2-3580-Y
Description	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED
state	Active	-	Active	-	Active	Active	Active	-
Optoelectronic device type	SINGLE COLOR LED	-	SINGLE COLOR LED	-	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	-

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