ILLUMINATION
LUXEON Z
Assembly and Handling Information
Introduction
This application brief addresses the recommended assembly and handling
procedures for LUXEON Z emitters. Proper assembly, handling, and thermal
management, as outlined in this application brief, ensure high optical output and
long lumen maintenance for LUXEON Z emitters.
Scope
The assembly and handling guidelines in this application brief apply to the following
products:
LUXEON Z White (all CCT & CRI)
LUXEON Z Lime (LXZ1-PX01)
LUXEON Z Green (LXZ1-PM01)
LUXEON Z Cyan (LXZ1-PE01)
LUXEON Z Blue (LXZ1-PB01)
LUXEON Z Royal Blue (LXZ1-PR01)
LUXEON Z Deep Red (LXZ1-PA01)
LUXEON Z Red (LXZ1-PD01)
LUXEON Z Red-Orange (LXZ1-PH01)
LUXEON Z Amber (LXZ1-PL01)
In the remainder of this document the term LUXEON Z refers to any product in the
LUXEON Z product family.
AB105 LUXEON Z Application Brief ©2017 Lumileds Holding B.V. All rights reserved.
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1 . Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Optical Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.3 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.5 Electrical Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.6 Mechanical Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.7 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2 . Printed Circuit Board Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
2.1 Footprint and Land Pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
2.2 Surface Finishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
2.3 Minimum Spacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3 . Thermal Measurement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4 . Assembly Process Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.1 Stencil Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.2 Pick-and-Place . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.3 Reflow Accuracy.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
5 . Packaging Considerations – Chemical Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
About Lumileds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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1. Component
1.1 Description
The LUXEON Z emitter is an ultra-compact, surface mount, high-power direct color or white LED. Each LUXEON Z
emitter consists of a high brightness InGaN or AlInGaP LED chip on a ceramic substrate. The ceramic substrate provides
mechanical support and provides a thermal path from the LED chip to the bottom of the emitter. An interconnect layer
electrically connects the LED chip to cathode and anode pads of equal size on the bottom of the ceramic substrate. The
cathode of the LUXEON Z emitter is marked with a small notch in the center of the electrode (see Figure 1).
The top of the LUXEON Z is covered with a thin layer of silicone to shield the chip from the environment. The bottom of the
LUXEON Z emitter contains two equally sized metallization pads for the anode and cathode.
All InGaN LUXEON Z emitters contain a transient voltage suppressor (TVS) chip which protects the LED chip against
electrostatic discharge (ESD) events. The TVS chip creates some minor topographical variations across the top surface of
the InGaN LUXEON Z emitters; all AlInGaP LUXEON Z emitters have a flat top surface.
The LUXEON Z emitter comes in four different form-factors, depending on the targeted color (see Table 1 and Figure 2):
Table 1. Summary of various LUXEON Z colors, chip technology, phosphor and nominal height of the light emitting area.
Figure 1. 3D renditions of LUXEON Z with InGaN chip (left & center) and AlInGaP chip (right).
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 2. The LUXEON Z emitter comes in four different form factors, depending on the targeted color.
All dimensions in mm.
1.2 Optical Center
The theoretical optical center of the LUXEON Z emitter is 0.625mm from the top and 0.650mm from the side edges of the
ceramic substrate (see Figure 3).
1.3 Handling Precautions
The LUXEON Z emitter is designed to maximize light output and reliability. However, improper handling of the emitter may
damage the LED chip and affect the overall performance and reliability. In order to minimize the risk of damage to the LED
chip during handling, LUXEON Z emitters should only be picked up manually from the side of the ceramic substrate as
shown in Figure 4.
Figure 3. The optical center of the LUXEON Z emitter is 0.625mm from the top and 0.650mm from the side edges.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 4. Correct handling (top) and incorrect handling (bottom) of LUXEON Z emitters.
When handling finished boards containing LUXEON Z emitters, do not touch the top surface with any fingers (see Figure
5a) or apply any pressure to it. Also, do no turn over the board for probing, if the electrodes are at the back of the board,
or stack multiple boards on top of each other (see Figure 5b). A rough or contaminated surface, which is placed on top of a
LUXEON Z emitter, may damage the silicone overcoat of the emitter. Furthermore, any pressure applied onto the LUXEON
Z emitter during probing may damage the silicone layer or the chip underneath.
1.4 Cleaning
The LUXEON Z emitter should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease
in optical output. In the event that the surface of a LUXEON Z emitter requires cleaning, a compressed gas duster at a
distance of 6” away will be sufficient to remove the dust and debris or an air gun with 20 psi (at nozzle) from a distance of
6”. Make sure the parts are secured first.
1.5 Electrical Isolation
The LUXEON Z emitter contains only two electrical pads on the bottom of the ceramic substrate with a spacing of 0.25mm
between them. In order to avoid any electrical shocks and/or damage to the LUXEON Z emitter, each design needs to
comply with the appropriate standards of safety and isolation distances, known as clearance and creepage distances,
respectively (e.g. IEC60950, clause 2.10.4).
1.6 Mechanical Files
Mechanical drawings for LUXEON Z (2D and 3D) are available upon request.
1.7 Soldering
LUXEON Z emitters are designed to be soldered onto a Printed Circuit Board (PCB). For detailed assembly instructions, see
Section 2. substrate as shown in Figure 4.
Figure 5. Do not touch the top of surface of the LUXEON Z emitter when handling a finished board (a) or stack
boards with one or more LUXEON Z emitters on top of each other (b).
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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