EEWORLDEEWORLDEEWORLD

Part Number

Search

EH3545TTS-18.432M TR

Description
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)
CategoryPassive components    oscillator   
File Size165KB,6 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric Compare View All

EH3545TTS-18.432M TR Overview

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

EH3545TTS-18.432M TR Parametric

Parameter NameAttribute value
Brand NameEcliptek
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSMD 3.2mm x 5.0mm
Contacts4
Manufacturer packaging codeSMD 3.2mm x 5.0mm
Reach Compliance Code163
Ageing5 PPM/YEAR
technologyCMOS

EH3545TTS-18.432M TR Preview

EH3545TTS-18.432M
EH35 45
Series
RoHS Compliant (Pb-free) 5.0V 4 Pad 3.2mm x 5mm
Ceramic SMD HCMOS/TTL High Frequency Oscillator
Frequency Tolerance/Stability
±50ppm Maximum
Operating Temperature Range
0°C to +70°C
RoHS
Pb
Nominal Frequency
18.432MHz
T TS -18.432M
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
18.432MHz
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25°C,
Shock, and Vibration)
±5ppm/year Maximum
0°C to +70°C
5.0Vdc ±10%
50mA Maximum (No Load)
2.4Vdc Minimum with TTL Load, Vdd-0.4Vdc Minimum with HCMOS Load (IOH = -16mA)
0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load (IOL = +16mA)
6nSec Maximum (Measured at 0.8Vdc to 2.0Vdc with TTL Load or at 20% to 80% of waveform with
HCMOS Load)
50 ±5(%) (Measured at 50% of waveform with TTL Load or with HCMOS Load)
10TTL Load or 50pF HCMOS Load Maximum
CMOS
Tri-State (Disabled Output: High Impedance)
+2.2Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to
enable output.
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum, ±30pSec Typical
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Pin 1 Connection
Tri-State Input Voltage (Vih and Vil)
Absolute Clock Jitter
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, MEthod 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 1 of 6
EH3545TTS-18.432M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
3
4
CONNECTION
Tri-State
Ground/Case Ground
Output
Supply Voltage
3.20
±0.20
MARKING
ORIENTATION
1.14
1.0
All Tolerances are ±0.1
1.20 ±0.20 (x4)
1.00 ±0.20 (x4)
4
5.00
±0.20
2.54
±0.15
3
1.3
MAX
2.20
±0.15
2
1
1.20
±0.20
(x4)
LINE MARKING
1
E18.432
E=Ecliptek Designator
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.4 (X4)
Solder Land
(X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 2 of 6
EH3545TTS-18.432M
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% or 2.0V
DC
50% or 1.4V
DC
20% or 0.8V
DC
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for TTL Output
Output Load
Drive Capability
10TTL
5TTL
2TTL
10LSTTL
1TTL
R
L
Value
(Ohms)
390
780
1100
2000
2200
C
L
Value
(pF)
15
15
6
15
3
Oscilloscope
Frequency
Counter
Table 1: R
L
Resistance Value and C
L
Capacitance
Value Vs. Output Load Drive Capability
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
R
L
(Note 4)
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
+
0.01µF
(Note 1)
0.1µF
(Note 1)
C
L
(Note 3)
Power
Supply
_
Ground
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
Note 4: Resistance value R
L
is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 3 of 6
EH3545TTS-18.432M
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 4 of 6
EH3545TTS-18.432M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 5 of 6

EH3545TTS-18.432M TR Related Products

EH3545TTS-18.432M TR EH3545TTS-18.432M
Description CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)
Brand Name Ecliptek Ecliptek
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Parts packaging code SMD 3.2mm x 5.0mm SMD 3.2mm x 5.0mm
Contacts 4 4
Manufacturer packaging code SMD 3.2mm x 5.0mm SMD 3.2mm x 5.0mm
Reach Compliance Code 163 compliant
A detailed introduction to grounding in pure electric vehicles
[i=s]This post was last edited by alan000345 on 2018-6-13 17:13[/i] [align=left][font=宋体][size=4] Many friends who have just come into contact with new energy pure electric vehicles do not know why th...
alan000345 Automotive Electronics
Which MSP430 can be connected to a large-capacity program memory?
The code is relatively large and requires external memory....
liso Microcontroller MCU
IAR library files "iostm8s103f3.h" and "stm8s.h" redefine alarms
I use the built-in iostm8s103f3.h and stm8s.h in IAR STM8 1.1. When defining together, a redefinitionWarning [Pe047] appears: incompatible redefinition of macro "AWU_TBR_AWUTB" (declared at line 1689 ...
baione123 stm32/stm8
Countdown timer assembly language design
3. Design requirements: Use assembly language to design a countdown timer for timing. After setting the initial value, start the countdown and it will start working. When the timing is over, use a buz...
2067267960 51mcu
Surveillance camera testing
What methods should users use to test surveillance cameras? Surveillance camera test steps and usage methods The surveillance camera mainly tests clarity and color reproduction, illumination, backligh...
xyh_521 Industrial Control Electronics
TI contains less information in one instruction than ADI
The more information an assembly instruction contains, the closer it is to a high-level language (a C statement contains more instruction information), and vice versa. Compared with assembly language,...
liuzi DSP and ARM Processors

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 677  336  1038  2227  2806  14  7  21  45  57 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号