W3E16M72SR200BI datasheet, PDF

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W3E16M72SR200BI: Description16M X 72 DDR DRAM, 0.75 ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219; Categorystorage storage; File Size744KB，16 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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W3E16M72SR200BI Overview

16M X 72 DDR DRAM, 0.75 ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219

W3E16M72SR200BI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	BGA
package instruction	BGA,
Contacts	219
Reach Compliance Code	unknown
access mode	FOUR BANK PAGE BURST
Maximum access time	0.75 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B219
memory density	1207959552 bit
Memory IC Type	DDR DRAM
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	219
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX72
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30

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White Electronic Designs

16Mx72 Registered DDR SDRAM

FEATURES

Registered for enhanced performance of bus

speeds of 200, 225, and 250 MHz

Package:

• 219 Plastic Ball Grid Array (PBGA), 32 x 25mm

2.5V ±0.2V core power supply

2.5V I/O (SSTL_2 compatible)

Differential clock inputs (CK and CK#)

Commands entered on each positive CK edge

Internal pipelined double-data-rate (DDR)

architecture; two data accesses per clock cycle

Programmable Burst length: 2,4 or 8

Bidirectional data strobe (DQS) transmitted/

received with data, i.e., source-synchronous data

capture (one per byte)

DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

DLL to align DQ and DQS transitions with CK

Four internal banks for concurrent operation

Two data mask (DM) pins for masking write data

Programmable I

option

Auto precharge option

W3E16M72SR-XBX

Auto Refresh and Self Refresh Modes

Commercial, Industrial and Military Temperature

Ranges

Organized as 16M x 72

Weight: W3E16M72SR-XBX - 2.5 grams typical

BENEFITS

47% SPACE SAVINGS

Glueless Connection to PCI Bridge/Memory

Controller

Reduced part count

Reduced I/O count

• 49% I/O Reduction

Reduced trace lengths for lower parasitic

capacitance

Suitable for hi-reliability applications

Laminate interposer for optimum TCE match

Upgradeable to 32M x 72 density (contact factory

for information)

* This product is subject to change without notice.

Monolithic Solution

22.3

11.9

TSOP

22.3

TSOP

12.6

8.3

TSOP

Actual Size

11.9

White Electronic Designs

W3E16M72SR-XBX

22.3

TSOP

12.6

TSOP

Area

I/O

Count

February 2005

Rev. 2

5 x 265mm2 + 2 x 105mm2 = 1536mm2

5 x 66 pins + 2 x 48 = 426 pins

800mm2

219 Balls

47%

49%

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

W3E16M72SR200BI Related Products

	W3E16M72SR200BI	W3E16M72SR250BM	W3E16M72SR200BM	W3E16M72SR225BI	W3E16M72SR225BM	W3E16M72SR225BC	W3E16M72SR200BC	W3E16M72SR250BC	W3E16M72SR250BI
Description	16M X 72 DDR DRAM, 0.75 ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16M X 72 DDR DRAM, 0.75 ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	32 X 25 MM, PLASTIC, BGA-219	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	219	219	219	219	219	219	219	219	219
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219
memory density	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	72	72	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	219	219	219	219	219	219	219	219	219
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	125 °C	70 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-55 °C	-	-	-	-40 °C
organize	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30
Maker	Microsemi	Microsemi	-	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi

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