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W3E16M72SR250BC

Description
16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
Categorystorage    storage   
File Size744KB,16 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

W3E16M72SR250BC Overview

16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219

W3E16M72SR250BC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeBGA
package instructionBGA,
Contacts219
Reach Compliance Codeunknown
access modeFOUR BANK PAGE BURST
Maximum access time0.75 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PBGA-B219
memory density1207959552 bit
Memory IC TypeDDR DRAM
memory width72
Number of functions1
Number of ports1
Number of terminals219
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX72
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
White Electronic Designs
16Mx72 Registered DDR SDRAM
FEATURES
Registered for enhanced performance of bus
speeds of 200, 225, and 250 MHz
Package:
• 219 Plastic Ball Grid Array (PBGA), 32 x 25mm
2.5V ±0.2V core power supply
2.5V I/O (SSTL_2 compatible)
Differential clock inputs (CK and CK#)
Commands entered on each positive CK edge
Internal pipelined double-data-rate (DDR)
architecture; two data accesses per clock cycle
Programmable Burst length: 2,4 or 8
Bidirectional data strobe (DQS) transmitted/
received with data, i.e., source-synchronous data
capture (one per byte)
DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
DLL to align DQ and DQS transitions with CK
Four internal banks for concurrent operation
Two data mask (DM) pins for masking write data
Programmable I
OL
/I
OH
option
Auto precharge option
W3E16M72SR-XBX
Auto Refresh and Self Refresh Modes
Commercial, Industrial and Military Temperature
Ranges
Organized as 16M x 72
Weight: W3E16M72SR-XBX - 2.5 grams typical
BENEFITS
47% SPACE SAVINGS
Glueless Connection to PCI Bridge/Memory
Controller
Reduced part count
Reduced I/O count
• 49% I/O Reduction
Reduced trace lengths for lower parasitic
capacitance
Suitable for hi-reliability applications
Laminate interposer for optimum TCE match
Upgradeable to 32M x 72 density (contact factory
for information)
* This product is subject to change without notice.
Monolithic Solution
22.3
11.9
66
TSOP
22.3
66
TSOP
12.6
8.3
48
TSOP
Actual Size
S
A
V
I
N
G
S
11.9
11.9
11.9
White Electronic Designs
W3E16M72SR-XBX
25
22.3
66
TSOP
66
TSOP
66
TSOP
12.6
48
TSOP
32
Area
I/O
Count
February 2005
Rev. 2
5 x 265mm2 + 2 x 105mm2 = 1536mm2
5 x 66 pins + 2 x 48 = 426 pins
1
800mm2
219 Balls
47%
49%
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

W3E16M72SR250BC Related Products

W3E16M72SR250BC W3E16M72SR250BM W3E16M72SR200BM W3E16M72SR225BI W3E16M72SR225BM W3E16M72SR225BC W3E16M72SR200BC W3E16M72SR200BI W3E16M72SR250BI
Description 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16M X 72 DDR DRAM, 0.75 ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16M X 72 DDR DRAM, 0.75 ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 16MX72 DDR DRAM, 0.75ns, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA, 32 X 25 MM, PLASTIC, BGA-219 BGA, BGA, BGA, BGA, BGA, BGA,
Contacts 219 219 219 219 219 219 219 219 219
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.75 ns 0.75 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219
memory density 1207959552 bit 1207959552 bit 1207959552 bit 1207959552 bit 1207959552 bit 1207959552 bit 1207959552 bit 1207959552 bit 1207959552 bi
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 72 72 72 72 72 72 72 72 72
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 219 219 219 219 219 219 219 219 219
word count 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 125 °C 85 °C 125 °C 70 °C 70 °C 85 °C 85 °C
Minimum operating temperature - -55 °C -55 °C -40 °C -55 °C - - -40 °C -40 °C
organize 16MX72 16MX72 16MX72 16MX72 16MX72 16MX72 16MX72 16MX72 16MX72
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES
Temperature level COMMERCIAL MILITARY MILITARY INDUSTRIAL MILITARY COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30 30
Maker Microsemi Microsemi - Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi
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