GD74HC58J datasheet, PDF - EEWORLD Datasheet

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GD74HC58J: DescriptionGate, CMOS, CDIP14,; Categorylogic logic; File Size169KB，4 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HC58J Overview

Gate, CMOS, CDIP14,

GD74HC58J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LG Semicon Co., Ltd.
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
MaximumI(ol)	0.004 A
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	32 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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GD74HC58J Related Products

	GD74HC58J	GD54HCT58J	GD74HCT58	GD74HCT58J	GD74HCT58D	GD74HC58	GD74HC58D	GD54HC58J
Description	Gate, CMOS, CDIP14,	Gate, CMOS, CDIP14,	Gate, CMOS, PDIP14,	Gate, CMOS, CDIP14,	Gate, CMOS, PDSO14,	Gate, CMOS, PDIP14,	Gate, CMOS, PDSO14,	Gate, CMOS, CDIP14,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 code	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	R-PDSO-G14	R-PDIP-T14	R-PDSO-G14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of terminals	14	14	14	14	14	14	14	14
Maximum operating temperature	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	SOP	DIP	SOP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	SOP14,.25	DIP14,.3	SOP14,.25	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	2/6 V	5 V	5 V	5 V	5 V	2/6 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO
surface mount	NO	NO	NO	NO	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	LG Semicon Co., Ltd.	-	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.
Prop。Delay @ Nom-Sup	32 ns	41 ns	36 ns	36 ns	36 ns	32 ns	32 ns	-

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