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GD74HCT58

Description
Gate, CMOS, PDIP14,
Categorylogic    logic   
File Size169KB,4 Pages
ManufacturerLG Semicon Co., Ltd.
Download Datasheet Parametric Compare View All

GD74HCT58 Overview

Gate, CMOS, PDIP14,

GD74HCT58 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLG Semicon Co., Ltd.
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T14
JESD-609 codee0
Load capacitance (CL)50 pF
MaximumI(ol)0.004 A
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Sup36 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

GD74HCT58 Related Products

GD74HCT58 GD54HCT58J GD74HCT58J GD74HCT58D GD74HC58 GD74HC58J GD74HC58D GD54HC58J
Description Gate, CMOS, PDIP14, Gate, CMOS, CDIP14, Gate, CMOS, CDIP14, Gate, CMOS, PDSO14, Gate, CMOS, PDIP14, Gate, CMOS, CDIP14, Gate, CMOS, PDSO14, Gate, CMOS, CDIP14,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
JESD-30 code R-PDIP-T14 R-XDIP-T14 R-XDIP-T14 R-PDSO-G14 R-PDIP-T14 R-XDIP-T14 R-PDSO-G14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Number of terminals 14 14 14 14 14 14 14 14
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -40 °C -55 °C -40 °C -40 °C -40 °C -40 °C -40 °C -55 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP SOP DIP DIP SOP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 SOP14,.25 DIP14,.3 DIP14,.3 SOP14,.25 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE
power supply 5 V 5 V 5 V 5 V 2/6 V 2/6 V 2/6 V 2/6 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO NO
surface mount NO NO NO YES NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker LG Semicon Co., Ltd. - LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd.
Prop。Delay @ Nom-Sup 36 ns 41 ns 36 ns 36 ns 32 ns 32 ns 32 ns -
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